| Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0 Ag-0.5 Cu solder joint NSM Zaimi, MAAM Salleh, M Abdullah, R Ahmad, M Mostapha, S Yoriya, ... Materials Today Communications 25, 101469, 2020 | 17 | 2020 |
| Formation and growth of intermetallic compounds in lead-free solder joints: a review MII Ramli, MAAM Salleh, MMAB Abdullah, NSM Zaimi, AV Sandu, ... Materials 15 (4), 1451, 2022 | 14 | 2022 |
| Performance of Sn-3.0 Ag-0.5 Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing NSM Zaimi, MAAM Salleh, AV Sandu, MMAB Abdullah, N Saud, ... Materials 14 (4), 776, 2021 | 9 | 2021 |
| Influence of non-metallic particles addition on wettability, intermetallic compound formation and microhardness of Sn-0.7 Cu lead free solder paste NSM Zaimi, MAA Mohd Salleh, AMM Al Bakri, RM Said, N Saud Solid State Phenomena 280, 169-174, 2018 | 9 | 2018 |
| Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0 Ag-0.5 Cu (SAC305) lead free solder NSM Zaimi, MAAM Salleh, MMAB Abdullah, M Mostapha, R Ahmad IOP Conference Series: Materials Science and Engineering 701 (1), 012033, 2019 | 6 | 2019 |
| The effect of geopolymer ceramic additions to the wettability and shear strength of Sn-Ag-Cu (SAC) solder: a preliminary study NSM Zaimi, MAAM Salleh, MMAB Abdullah, M Mostapha, R Ahmad IOP Conference Series: Materials Science and Engineering 551 (1), 012081, 2019 | 6 | 2019 |
| Liquid/solid interaction of Sn-58Bi/Sn-3.0 Ag-0.5 Cu dissimilar joints during soldering at low temperature by in-situ synchrotron imaging MII Ramli, MAAM Salleh, T Nishimura, H Yasuda, NSM Zaimi, K Nogita JOM 74 (7), 2760-2769, 2022 | 3 | 2022 |
| Effect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0 Ag-0.5 Cu solder joints during multiple reflow NSM Zaimi, MAAM Salleh, MMAB Abdullah, NIM Nadzri, AV Sandu, ... Materials 15 (8), 2758, 2022 | 3 | 2022 |
| Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0 Ag-0.5 Cu Solder Joints F Somidin, NFN Ilias, NSM Zaimi, MII Ramli, NRA Razak Journal of Physics: Conference Series 2169 (1), 012032, 2022 | 2 | 2022 |
| Synthesis of Kaolin Geopolymer as Ceramic Reinforcement in Lead-Free Solder NSM Zaimi, MII Ramli, MAAM Salleh, MMAB Abdullah, J Chaiprapa, ... Journal of Physics: Conference Series 2169 (1), 012019, 2022 | 1 | 2022 |
| Characterization of geopolymer ceramic reinforced Sn-0.7 Cu composite solder: Effect of milling time and speed. M Mostapha, MAAM Salleh, MMAB Abdullah, M Thiaghu, NSM Zaimi, ... IOP Conference Series: Materials Science and Engineering 701 (1), 012016, 2019 | 1 | 2019 |
| A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY. NSM Zaimi, MAAM Salleh, MM Al Bakri Abdullah, MII Ramli Archives of Metallurgy & Materials 68 (3), 2023 | | 2023 |
| Effect of Isothermal Aging on Mechanical Properties of Sn–0.7 Cu–xZn Lead-Free Solder MII Ramli, MFH Baser, NS Mohamad Zaimi, CY Tan Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Effect of Sb Addition to the Solidification and Microstructure of Sn–Ag–Cu Alloys MII Ramli, MS A’isyah, A Azani, NS Mohamad Zaimi Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Effect of Al Addition to the Solidification and Microstructure Formation on Sn–Ag–Cu Solder Alloy MII Ramli, AN Saim, NS Mohamad Zaimi Green Materials and Electronic Packaging Interconnect Technology Symposium, 3-10, 2022 | | 2022 |
| Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder N Saud, MAA Mohd Salleh, R Mohd Said, F Somidin, NS Mohamad Zaimi, ... Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | | 2022 |
| Development of Geopolymer Ceramic-Reinforced Solder MMAB Abdullah, MAAM Salleh, NNI Zulkifli, NSM Zaimi, R Ahmad, ... Recent Progress in Lead-Free Solder Technology: Materials Development …, 2022 | | 2022 |
| Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste RM Said, NRA Razak, F Somidin, NSM Zaimi Journal of Physics: Conference Series 2169 (1), 012010, 2022 | | 2022 |
| Impact of Thermal Ageing and Multiple Reflow on Lead Free Composite Solder: A Short Review NSM Zaimi, MAAM Salleh, MMAB Abdullah, M Mostapha, R Ahmad IOP Conference Series: Materials Science and Engineering 957 (1), 012063, 2020 | | 2020 |
| Void Distributions in Sn-3.0 Ag-0.5 Cu (SAC305) Composite Lead Free Solder Subjected to Thermal Ageing Using Acoustic Micro Imaging Technique NSM Zaimi, M Salleh, M Abdullah, M Mostapha, MS Baltatu, R Ahmad IOP Conference Series: Materials Science and Engineering 877 (1), 012014, 2020 | | 2020 |
Mohd Arif Anuar Mohd SallehUniversity Malaysia Perlisبريد إلكتروني تم التحقق منه على unimap.edu.my
