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T LACHANA DORA
T LACHANA DORA
BITS Pilani, Pilani Campus
Verified email at pilani.bits-pilani.ac.in
Title
Cited by
Cited by
Year
A review on fabrication methods, reinforcements and mechanical properties of aluminum matrix composites
V Chak, H Chattopadhyay, TL Dora
Journal of manufacturing processes 56, 1059-1074, 2020
2152020
Application of solid processing routes for the synthesis of graphene-aluminum composites-a review
V Chak, H Chattopadhyay, TL Dora
Materials and Manufacturing Processes 36 (11), 1219-1235, 2021
162021
Thermo-physical characteristics of 3C‐SiC structure subjected to microwave exposure: A molecular dynamics study
TL Dora, A Owhal, T Roy, SU Belgamwar, S Goel, HY Nezhad, RR Mishra
Materials Today Communications 35, 105693, 2023
62023
Role of crystal orientation, temperature, and strain rate on the mechanical characterization of nickel: an atomistic-scale investigation
TL Dora, SK Singh, RR Mishra, A Verma
Journal of Micromanufacturing, 25165984231195519, 2023
42023
Deformation and boundary motion analysis of a faceted twin grain boundary
TL Dora, SK Singh, RR Mishra, ER Homer, S Ogata, A Verma
International Journal of Mechanical Sciences 269, 109044, 2024
22024
Unravelling the atomistic-scale insights into tensile response of equiatomic cupronickel alloy with pre-existing faceted grain boundary interface
TL Dora, SK Singh, RR Mishra, R Das, J Gupta, A Verma
Results in Surfaces and Interfaces 14, 100172, 2024
12024
Synergistic effects of temperature and strain rate on tensile properties of simulated Ni-6Cu alloy with Σ3 non-Arrhenius grain boundary
TL Dora, SK Singh, Kriti, RR Mishra, A Verma
Molecular Simulation, 1-13, 2024
2024
A Molecular Dynamics Based Atomistic-scale Study to Investigate Mechanical Properties of Σ3 Incoherent Non-Arrhenius Grain Boundary
TL Dora, Sandeep Kumar Singh, Akarsh Verma, Shigenobu Ogata, Radha Raman Mishra
The Materials Science & Technology (MS&T23), Columbus, Ohio, USA, 2023
2023
Study of Microwave Heating of Vacancy Induced 3C-SiC: A Molecular Dynamics Approach
TL Dora, RR Mishra
19th International Conference on Microwave and High-Frequency Applications, 2023
2023
Molecular dynamics study on tensile strength of Ni-10Cu alloy with pre-existing Σ3 grain boundary
T L Dora, Sandeep Kumar Singh, Akarsh Verma, Radha Raman Mishra
2nd International Conference on Mechanical Engineering (INCOME 2023), Delhi …, 2023
2023
Processing of polymer composites: autoclave and microwave energy approaches
TL Dora, RR Mishra
Composites Assembly for High Performance Fastener-less Structures 15, 29, 2022
2022
Microwave Processing of Materials: Fundamentals and Applications
TL Dora, RR Mishra
Advances in Microwave Processing for Engineering Materials, 1-18, 2022
2022
Optimization of Preform for Stub Axle Forging Using Simulation Software
TL Dora, NK Singh, R Ohdar
THERMEC 2020 1016, 1337-1343, 2021
2021
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