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- Gerhard KlimeckProfessor of Electrical and Computer Engineering, Purdue UniversityVerified email at purdue.edu
- Michael PovolotskyiJacobs TechnologiesVerified email at jacobs.com
- James CharlesPurdue UniversityVerified email at purdue.edu
- Yaohua TanUniversity of VirginiaVerified email at purdue.edu
- Prasad SarangapaniRigetti Computing Inc.Verified email at rigetti.com
- Zhengping JiangSamsung Semiconductor Inc.Verified email at samsung.com
- Yu HeSynopsys Inc.Verified email at SYNOPSYS.COM
- Timothy BoykinUniversity of Alabama in HuntsvilleVerified email at uah.edu
- James E FonsecaPurdue UniversityVerified email at purdue.edu
- Christoph DeutschVienna University of TechnologyVerified email at tuwien.ac.at
- Saumitra MehrotraNXP SemiconductorsVerified email at nxp.com
- Ganesh HegdeAdvanced Logic Lab, Samsung Semiconductor IncVerified email at ssi.samsung.com
- Mark J.W. RodwellProfessor of Electrical and Computer Engineering, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- Christian JirauschekProfessor für Elektrotechnik und Informationstechnik, Technische Universität MünchenVerified email at tum.de
- Dr. Stefan Birnernextnano GmbH, GermanyVerified email at nextnano.com
- Gottfried StrasserProfessor Materials Engineering for Nanoelectronics, TU WienVerified email at tuwien.ac.at
- Aaron Maxwell AndrewsTU WienVerified email at tuwien.ac.at
- Timothy S FisherMechanical & Aerospace Engineering, University of California Los AngelesVerified email at g.ucla.edu
- Kai MiaoPurdue UniversityVerified email at purdue.edu
- Kazuhiko HirakawaUniversity of TokyoVerified email at iis.u-tokyo.ac.jp