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Co-authors
- Laurens W MolenkampPhysics Institute (EP3) and Institute for Topological Insulators, Würzburg UniversityVerified email at physik.uni-wuerzburg.de
- Wouter BeugelingJulius-Maximilians-Universität, Würzburg, GermanyVerified email at physik.uni-wuerzburg.de
- Philipp LeubnerTechnical Sales Engineer Research, attocube systems AGVerified email at attocube.com
- Giordano ScappucciQuTech, TU DelftVerified email at tudelft.nl
- Wolfgang M. KlesseIHPVerified email at ihp-microelectronics.com
- B. TrauzettelInstitut für Theoretische Physik und Astrophysik, Universität Würzburg, GermanyVerified email at physik.uni-wuerzburg.de
- Bent WeberNanyang Technological UniversityVerified email at ntu.edu.sg
- niccolò traverso zianiUniversità di GenovaVerified email at physik.uni-wuerzburg.de
- Christoph FleckensteinDepartment of Physics, KTH Royal Institute of Technology, StockholmVerified email at kth.se
- Kallol RoyResearch Fellow, NUS, SingaporeVerified email at nus.edu.sg
- Ranjit KashidScientist, Centre for Materials for Electronics TechnologyVerified email at cmet.gov.in
- Kimberly HsiehCryo Engineer | Scientist, BlueforsVerified email at bluefors.com
- Tanweer AhmedCIC nanoGUNEVerified email at nanogune.eu
- Craig PolleyBeamline Scientist, MAX IV LaboratoryVerified email at maxiv.lu.se
- David A RitchieUniversity of Cambridge and Swansea UniversityVerified email at cam.ac.uk
- Ian FarrerElectronic and Electrical Engineering, University of SheffieldVerified email at sheffield.ac.uk
- Srijit GoswamiQuTech, TU DelftVerified email at tudelft.nl
- Md. Ali AamirPost-doctoral researcherVerified email at chalmers.se