Get my own profile
Public access
View all4 articles
0 articles
available
not available
Based on funding mandates
Co-authors
- Dimitri LintenImecVerified email at imec.be
- Jacopo FrancoimecVerified email at imec.be
- Bertrand Parvaisimec & VUBVerified email at imec.be
- Ben KaczerimecVerified email at imec.be
- Alireza AlianimecVerified email at imec.be
- Guido Groesenekenimec and KU LeuvenVerified email at imec.be
- Uthayasankaran PeralaguIMECVerified email at imec.be
- Aaron TheanNational University of SingaporeVerified email at nus.edu.sg
- Ming ZhaoTechnical Director-GaN at NexperiaVerified email at nexperia.com
- Marko SimicicR&D engineer at Imec, BelgiumVerified email at imec.be
- Gerhard RzepaGlobal TCAD SolutionsVerified email at globaltcad.com
- Qi XiePrincipal Scientist at ASM Corporate R&DVerified email at fudan.edu.cn
- Michael E. Givens, Ph.D.Senior Director & Executive Technologist, ASM Corporate R&D, Leuven, BelgiumVerified email at asm.com
- Tibor GrasserProfessor at TU Wien, Head of Institute for Microelectronics, Fellow IEEEVerified email at iue.tuwien.ac.at
- Adrian ChasinimecVerified email at imec.be
- Daniel M. FleetwoodProfessor of Electrical Engineering, Vanderbilt UniversityVerified email at vanderbilt.edu
- Robin DegraeveimecVerified email at imec.be
- Enxia ZhangUniversity of Central FloridaVerified email at ucf.edu
- Stefano BonaldoUniversity of PadovaVerified email at dei.unipd.it
- Ron SchrimpfProfessor of Electrical Engineering, Vanderbilt UniversityVerified email at vanderbilt.edu