| Stack-up and routing optimization by understanding micro-scale PCB effects G Romo, C Nwachukwu, R Torres-Torres, SW Baek, M Schauer Proc. DesignCon, 758-782, 2011 | 32 | 2011 |
| Fast algorithm for minimizing the number of decap in power distribution networks K Koo, GR Luevano, T Wang, S Özbayat, T Michalka, JL Drewniak IEEE Transactions on Electromagnetic Compatibility 60 (3), 725-732, 2017 | 27 | 2017 |
| Modeling facet heating in ridge lasers G Romo, T Smy, D Walkey, B Reid Microelectronics Reliability 43 (1), 99-110, 2003 | 22 | 2003 |
| Design and modeling for chip-to-chip communication at 20 Gbps J Zhang, QB Chen, K Qiu, AC Scogna, M Schauer, G Romo, JL Drewniak, ... 2010 IEEE International Symposium on Electromagnetic Compatibility, 467-472, 2010 | 19 | 2010 |
| Characterization of electrical transitions using transmission line measurements R Torres-Torres, G Hernández-Sosa, G Romo, A Sánchez IEEE Transactions on Advanced Packaging 32 (1), 45-52, 2009 | 19 | 2009 |
| Modeling resonances in transmission lines fabricated over woven fiber substrates R Torres-Torres, G Romo, M Schauer, C Nwachukwu, SW Baek IEEE transactions on microwave theory and techniques 61 (7), 2558-2565, 2013 | 14 | 2013 |
| Full characterization of substrate integrated waveguides from S-parameter measurements R Torres-Torres, G Romo, B Horine, A Sachez, H Heck 2006 IEEE Electrical Performane of Electronic Packaging, 277-280, 2006 | 14 | 2006 |
| Analytical characteristic impedance determination method for microstrip lines fabricated on printed circuit boards R Torres‐Torres, G Romo, L Armenta, B Horine International Journal of RF and Microwave Computer‐Aided Engineering: Co …, 2009 | 13 | 2009 |
| Understanding and mitigation of fiber weave effects in striplines M Schauer, G Romo, R Torres-Torres, C Nwachukwu, SW Baek Proc. DesignCon 1, 664-687, 2012 | 12 | 2012 |
| Chip-to-Chip Communication Beyond 25 Gbps--Modeling and Realization J Zhang, M Schauer, QB Chen, AC Scogna, K Qiu, G Romo, L Boluna DesignCon 2010, 1-4, 2010 | 11 | 2010 |
| Practical investigations of fiber weave effects on high-speed interfaces GR Luevano, J Shin, T Michalka 2013 IEEE 63rd Electronic Components and Technology Conference, 2041-2045, 2013 | 10 | 2013 |
| Substrate integrated waveguide (SIW) filter: Design methodology and performance study G Romo, AC Scogna 2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity …, 2009 | 10 | 2009 |
| Impact of the configuration of ground vias on the performance of vertical transitions used in electronic packages SC Sejas-Garcia, G Romo, R Torres-Torres 2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity …, 2009 | 9 | 2009 |
| Dispersion relation calculation of photonic crystals using the transmission line matrix method G Romo, T Smy International Journal of Numerical Modelling: Electronic Networks, Devices …, 2004 | 8 | 2004 |
| Modeling of photonic crystals using a real-valued transmission line matrix method G Romo, T Smy Journal of applied physics 94 (4), 2177-2182, 2003 | 8 | 2003 |
| Characterization and modeling of electronic packages using S-parameters G Hernandez-Sosa, G Romo, R Torres-Torres 2008 7th International Caribbean Conference on Devices, Circuits and Systems …, 2008 | 7 | 2008 |
| Fast decap assignment algorithm for optimization of power distribution networks K Koo, LG Romo, T Wang, T Michalka, J Drewniak 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 6 | 2017 |
| PDN design and sensitivity analysis using synthesized models in DDR SI/PI co-simulations J Mohamed, T Michalka, S Ozbayat, GR Luevano 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2018 | 5 | 2018 |
| Higher order multiple input multiple output in ethernet D Zhang, G Shi, WJ McFarland, Y Huang, GR Luevano, JM Shin, KK Dao US Patent 9,450,644, 2016 | 5 | 2016 |
| Copper roughness induced gain for inductance and resistance on stripline interconnects GR Luevano, T Michalka, V Sonawane, V Sriboonlue 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 4 | 2022 |
