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Co-authors
Anubhav JainLawrence Berkeley National LabVerified email at lbl.gov- Kristin Aslaug Persson (nee Einarsdott...UC Berkeley/Lawrence Berkeley National LaboratoryVerified email at lbl.gov
- Shyue Ping OngUniversity of California San DiegoVerified email at ucsd.edu
- Dane MorganUniversity of Wisconsin, Materials ScienceVerified email at wisc.edu
- Geoffroy HautierDartmouth CollegeVerified email at dartmouth.edu
- William D RichardsMITVerified email at mit.edu
- Ying Shirley MengThe University of Chicago, Argonne National LaboratoryVerified email at uchicago.edu
- Anton Van der VenUniversity of California Santa BarbaraVerified email at engineering.ucsb.edu
- Lincoln MiaraEngineer, Samsung ElectronicsVerified email at bu.edu
- Yan(Eric) Wang 王琰Samsung; MIT; LBNLVerified email at samsung.com
- Kisuk KangSeoul National University, Department of Materials Science and EngineeringVerified email at snu.ac.kr
- Clare P. GreyYusuf Hamied Department of Chemistry, University of CambridgeVerified email at cam.ac.uk
- Rahul MalikVerified email at mit.edu
- M. AstaUniversity of California, Sandia National Laboratories, Northwestern UniversityVerified email at berkeley.edu
- Jae Chul KimStevens Institute of TechnologyVerified email at stevens.edu
- Mehmet Kadri AydinolMiddle East Technical UniversityVerified email at metu.edu.tr
- Haegyeom KimStaff Scientist (Principal Investigator) at Lawrence Berkeley National LaboratoryVerified email at lbl.gov
- Alexander UrbanColumbia UniversityVerified email at columbia.edu
- Shou-Hang BoU Michigan - Shanghai Jiao Tong University Joint InstitueVerified email at sjtu.edu.cn
- Chris FischerDirector of Applications Engineering at Pellion TechnologiesVerified email at alum.mit.edu
