| High-speed testing and material modeling of unfilled styrene butadiene vulcanizates at impact rates MSH Fatt, I Bekar Journal of Materials Science 39, 6885-6899, 2004 | 40 | 2004 |
| Deformation and fracture of rubber under tensile impact loading I Bekar, MSH Fatt, J Padovan Tire Science and Technology 30 (1), 45-58, 2002 | 28 | 2002 |
| Tensile impact apparatus MSH Fatt, I Bekar, J Padoyan US Patent 7,320,242, 2008 | 14 | 2008 |
| Delamination/cracking mechanism study for ultra-thin stacked-die chip scale packages XJ Fan, I Bekar, A Fischer, Y He, ZY Huang, E Prack Intel Conference on Manufacturing Excellence (IMEC), 2006 | 10 | 2006 |
| No flow underfill device and method S Subramanian, M Modi, I Bekar US Patent App. 11/167,073, 2007 | 3 | 2007 |
| Dicing tape format die-attach film selection methodology for ultra-thin stacked die chip scale packages X Fan, D Shi, I Bekar, E Prack, J Wang, Z Huang, Y He, A Fischer, S Cho IEEE Electronic Components and Technology Conference (ECTC), 2007 | 2 | 2007 |
| Hybrid interconnect for low temperature attach KJ Mirpuri, H Jiang, TN Osborn, RS Sidhu, I Bekar, SG Jadhav US Patent App. 14/430,131, 2016 | 1 | 2016 |
| Analytical homogenization for microelectronic substrates M Modi, D Kulkarni, A Bao, I Bekar, S Cho ASME International Mechanical Engineering Congress and Exposition 42991, 397-406, 2007 | 1 | 2007 |
| Characterization and modeling of non-linear inelastic behavior of organic packages at component and system levels T Zheng, M Tao, P Nardi, M Modi, S Sane, I Bekar 2008 58th Electronic Components and Technology Conference, 753-759, 2008 | | 2008 |
Michelle S. Hoo FattProfessor of Mechanical EngineeringVerified email at uakron.edu
