| The effects of nitrogen partial pressure on the properties of the TaNx films deposited by reactive magnetron sputtering TC Li, BJ Lwo, NW Pu, SP Yu, CH Kao Surface and Coatings Technology 201 (3-4), 1031-1036, 2006 | 38 | 2006 |
| In-plane packaging stress measurements through piezoresistive sensors BJ Lwo, TS Chen, CH Kao, YL Lin J. Electron. Packag. 124 (2), 115-121, 2002 | 30 | 2002 |
| On the study of piezoresistive stress sensors for microelectronic packaging BJ Lwo, CH Kao, TS Chen, YS Chen J. Electron. Packag. 124 (1), 22-26, 2002 | 27 | 2002 |
| Transversely varying thickness modes in trapped energy resonators with shallow and beveled contours HF Tiersten, BJ Lwo, B Dulmet Journal of applied physics 80 (2), 1037-1046, 1996 | 24 | 1996 |
| Measurement of moisture-induced packaging stress with piezoresistive sensors BJ Lwo, CS Lin IEEE transactions on advanced packaging 30 (3), 393-401, 2007 | 22 | 2007 |
| Calibrate piezoresistive stress sensors through the assembled structure BJ Lwo, SY Wu J. Electron. Packag. 125 (2), 289-293, 2003 | 21 | 2003 |
| In situ stress and reliability monitoring on plastic packaging through piezoresistive stress sensor YY Chang, H Chung, BJ Lwo, KF Tseng IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8 …, 2013 | 19 | 2013 |
| Large-area laying of soft textile power generators for the realization of body heat harvesting clothing YS Chen, BJ Lwo Coatings 9 (12), 831, 2019 | 15 | 2019 |
| An analysis of transversely varying thickness modes in trapped energy resonators with shallow contours HF Tiersten, BJ Lwo, B Dulmet Proceedings of IEEE 48th Annual Symposium on Frequency Control, 172-183, 1994 | 15 | 1994 |
| TSV reliability model under various stress tests BJ Lwo, MS Lin, KH Huang 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 620-624, 2014 | 11 | 2014 |
| The advanced pattern designs with electrical test methodologies on through silicon via for CMOS image sensor H Chung, CY Ni, CM Tu, YY Chang, YT Haung, WM Chen, BY Lou, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 11 | 2010 |
| Global-local procedure for the heat conduction analysis of multichip modules TL Sham, HF Tiersten, PL Baehmann, LY Song, YS Zhou, BJ Lwo, ... Proceedings of the ASME International Electronics Packaging Conference. Part …, 1993 | 11 | 1993 |
| A complete resistance extraction methodology and circuit models for typical TSV structures H Chung, CM Tu, BJ Lwo, CY Lee International Journal of Electronics 100 (9), 1256-1269, 2013 | 9 | 2013 |
| Global-local procedure for the thermoelastic analysis of multichip modules HF Tiersten, TL Sham, BJ Lwo, YS Shou, PL Baehmann, YL Le Coz, ... Proceedings of the 1993 ASME international electronics packaging conference, 1993 | 9 | 1993 |
| In situ chip stress extractions for LFBGA packages through piezoresistive sensors BJ Lwo, JS Su, H Chung | 7 | 2009 |
| Calibration of piezoresistive stress sensors in electronic packaging CY Lin, TS Chen, BJ Lwo, YS Chen, TT Ho, CY Lee, CH Kao Proc. 6th Symp. Nano Device Technol., 173-176, 1999 | 7 | 1999 |
| Calibrate MOSFET micro-stress sensors for electronic packaging H Chung, CP Tang, YC Chao, KF Tseng, BJ Lwo 2008 10th Electronics Packaging Technology Conference, 650-656, 2008 | 6 | 2008 |
| A multifunctional test chip for microelectronic packaging and its application on RF property measurements KF Tseng, YH Hsion, BJ Lwo International journal of electronics 94 (6), 633-643, 2007 | 6 | 2007 |
| LFBGA packaging stress measurements with piezoresistive sensors BJ Lwo, KF Tseng, CH Kao, TS Chen, JS Su Proceedings of the 4th International Symposium on Electronic Materials and …, 2002 | 6 | 2002 |
| Global/local analyses of multichip modules: Automated 3-d model construction and adaptive finite element analysis MS Shephard, TL Sham, LY Song, VS Wong, R Garimella, HF Tiersten, ... Proceedings of the 1993 ASME International Electronics Packaging Conference, 1993 | 6 | 1993 |
Yao-Shing ChenNational Defense University
Yao-Shing ChenNational Defense University