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Co-authors
- Nadine CollaertimecVerified email at imec.be
- Bertrand Parvaisimec & VUBVerified email at imec.be
- Xiao GongNational University of SingaporeVerified email at nus.edu.sg
- Uthayasankaran PeralaguIMECVerified email at imec.be
- Alireza AlianimecVerified email at imec.be
- Yee-Chia YeoNational University of SingaporeVerified email at nus.edu.sg
- Ming ZhaoTechnical Director-GaN at NexperiaVerified email at nexperia.com
- Kwang Hong Lee, KH LeeNanyang Technological University, Singapore-Mit alliance for research and technologyVerified email at smart.mit.edu
- Gengchiau LiangNational Yang Ming Chiao Tung UniversityVerified email at nycu.edu.tw
- PUTCHA VAMSIResearcher, IMECVerified email at imec.be
- Kian Hua TanNational University of SingaporeVerified email at nus.edu.sg
- E A FitzgeraldCornell, ATT, MIT, Massachusetts Institute of Technology, NTUVerified email at mit.edu
- Chuan Seng TanProfessor, Nanyang Technological University, Singapore | IEEE Fellow | IMAPS FellowVerified email at ntu.edu.sg
- Jean-Pierre RaskinUniversité catholique de Louvain, Engineering School of LouvainVerified email at uclouvain.be
- Pieter CardinaelPhD Student, UCLouvainVerified email at uclouvain.be
- Nguyen Xuan SangNational University of SingaporeVerified email at u.nus.edu
- Annie KumarR & D Engineer, IMECVerified email at imec.be
- David KohenIntelVerified email at intel.com
- Yuan DONGInstitute of Microelectronics (IME, A*Star), and National University of Singapore (NUS)Verified email at u.nus.edu
- Dian LeiMicron Technology, National University of SingaporeVerified email at u.nus.edu