| A state-of-the-art review of fatigue life prediction models for solder joint S Su, FJ Akkara, R Thaper, A Alkhazali, M Hamasha, S Hamasha Journal of Electronic Packaging 141 (4), 040802, 2019 | 65 | 2019 |
| Effect of cycling amplitude variations on SnAgCu solder joint fatigue life F Akkara, S Su, H Ali, P Borgesen IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 43 | 2018 |
| Solder joint reliability in isothermal varying load cycling S Su, F Akkara, A Dawahdeh, P Borgesen, A Qasaimeh 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 42 | 2017 |
| Effect of surface finish and high bi solder alloy on component reliability in thermal cycling F Akkara, M Abueed, M Rababah, C Zhao, S Su, J Suhling, J Evans 2018 IEEE 68th electronic components and technology conference (ECTC), 2032-2040, 2018 | 36 | 2018 |
| Fatigue properties of lead-free doped solder joints S Su, FJ Akkara, M Abueed, M Jian, J Suhling, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 34 | 2018 |
| Effect of long-term room temperature aging on the fatigue properties of SnAgCu solder joint S Su, N Fu, F John Akkara, S Hamasha Journal of Electronic Packaging 140 (3), 031005, 2018 | 33 | 2018 |
| Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling FJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 26 | 2018 |
| The effect of Bi on the mechanical properties of aged SAC solder joint MEA Belhadi, FJ Akkara, R Athamenh, M Abueed, H Ali, J Suhling, P Lall 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 22 | 2020 |
| The effect of micro-alloying and surface finishes on the thermal cycling reliability of doped SAC solder alloys FJ Akkara, S Hamasha, A Alahmer, J Evans, MEA Belhadi, X Wei Materials 15 (19), 6759, 2022 | 19 | 2022 |
| Effects of long-term aging on SnAgCu solder joints reliability in mechanical cycling fatigue F Akkara, S Su, S Thirugnanasambandam, A Dawahdeh, A Qasaimeh, ... SMTA International Conference, 17-21, 2017 | 19 | 2017 |
| Micro indentation measurements of the creep properties of CABGA doped solder joint MEA Belhadi, FJ Akkara, MA Hoque, PP Vyas, X Wei, A Shmatok, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 17 | 2021 |
| Fatigue and shear properties of high reliable solder joints for harsh applications S Su, M Jian, FJ Akkara, S Hamasha, J Suhling, P Lall SMTA International, 14-18, 2018 | 15 | 2018 |
| Effect of surface finish on the fatigue behavior of Bi-based solder joints S Su, M Jian, X Wei, FJ Akkara, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 14 | 2019 |
| Effect of new SAC-Bi solder pastes on thermal cycling reliability considering aging MEA Belhadi, F Akkara, M Jian, SD Hamasha SMTA International conference, 2020 | 13 | 2020 |
| Effects of mixing solder sphere alloys with bismuth-based pastes on the component reliability in harsh thermal cycling FJ Akkara, C Zhao, S Su, S Hamasha, J Suhling SMTA International, 2018 | 13 | 2018 |
| Reliability of micro-alloyed SnAgCu Based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 11 | 2019 |
| Reliability of doped ball grid array components in thermal cycling after long-term isothermal aging S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ... SMTA International, 438-442, 2017 | 11 | 2017 |
| Effect of Aging on Component Reliability in Harsh Thermal Cycling FJ Akkara, C Zhao, S Gordon, S Su, M Abueed, J Suhling, P Lall 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 8 | 2019 |
| Reliability of new SAC-Bi solder alloys in thermal cycling with aging FJ Akkara, M Abueed, M Belhadi, X Wei, S Hamasha, H Ali, J Suhling, ... Proceedings of IPC APEX, 1-8, 2020 | 6 | 2020 |
| Thermal cycling reliability of newly developed lead-free solders for harsh environments FJ Akkara, C Zhao, S Ahmed, M Abueed, S Su, SD Hamasha, J Suhling, ... Proc. SMTA Int, 2019 | 5 | 2019 |
Sinan Su, Ph.D.CAVE3, Industrial & Systems Engineering, Auburn UniversityVerified email at auburn.edu
