| Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon Microelectronics Reliability 51 (1), 67-74, 2011 | 39 | 2011 |
| High productivity thermocompression flip chip bonding H Clauberg, A Marte, Y Yang, J Eder, T Colosimo, D Buergi, A Rezvani, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 22-29, 2015 | 23 | 2015 |
| Wire bonded 3D coils render air core microtransformers competitive A Moazenzadeh, N Spengler, R Lausecker, A Rezvani, M Mayer, ... Journal of Micromechanics and Microengineering 23 (11), 114020, 2013 | 22 | 2013 |
| Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding A Rezvani, A Shah, M Mayer, Y Zhou, JT Moon Microelectronics Reliability 53 (7), 1002-1008, 2013 | 20 | 2013 |
| Chip-to-chip and chip-to-wafer thermocompression flip chip bonding H Clauberg, A Rezvani, V Venkatesan, G Frick, B Chylak, T Strothmann 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 600-605, 2016 | 17 | 2016 |
| Free-air ball formation and deformability with Pd coated Cu wire A Rezvani, M Mayer, A Shah, N Zhou, SJ Hong, JT Moon 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1516-1522, 2011 | 17 | 2011 |
| High throughput thermo-compression bonding with pre-applied underfill for 3D memory applications ABY Lim, A Rezvani, RD Bacay, T Colosimo, O Yauw, H Clauberg, ... 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 427-434, 2016 | 9 | 2016 |
| Monitoring of thermo-mechanical stress via CMOS sensor array: Effects of warpage and tilt in flip chip thermo-compression bonding A Laor, D Athia, A Rezvani, H Clauberg, M Mayer Microelectronics Reliability 73, 60-68, 2017 | 8 | 2017 |
| Thermocompression flip chip bonding optimization for pre-applied underfill H Clauberg, A Rezvani, D Buergi, T Colosimo, G Frick, O Yauw, ... 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-4, 2015 | 8 | 2015 |
| Development of advanced wire bonding technology for QFN devices H Xu, A Rezvani, J Brunner, J Foley, I Qin, B Chylak 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1385-1391, 2015 | 8 | 2015 |
| Numerical simulations of joint-to-joint temperature variation during thermo-compression bonding D Athia, A Rezvani, H Clauberg, I Qin, M Mayer 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1906-1915, 2017 | 4 | 2017 |
| Advanced thermocompression flip chip bonding H Clauberg, A Rezvani, E Galipeau, M Wasserman, T Colosimo, G Frick, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 492-495, 2014 | 4 | 2014 |
| Stitch bond process of Pd-coated Cu wire: Experimental and numerical studies of process parameters and materials A Rezvani, M Mayer, I Qin, J Brunner, B Chylak International Symposium on Microelectronics 2013 (1), 000312-000317, 2013 | 4 | 2013 |
| The role of friction coefficient on the stitch bondability in Pd coated Cu and bare Cu wire bonding A Rezvani, C Nan, M Mayer, I Qin 2012 IEEE 62nd Electronic Components and Technology Conference, 2150-2156, 2012 | 3 | 2012 |
| Experimental and numerical study of the mechanical aspects of the stitch bonding process in microelectronic wire bonding A Rezvanigilkolaee University of Waterloo, 2014 | 1 | 2014 |
Michael MayerAssociate Professor of Mechanical and Mechatronics Engineering, University of WaterlooVerified email at uwaterloo.ca
