Get my own profile
Public access
View all29 articles
16 articles
available
not available
Based on funding mandates
Co-authors
- Hui-Ming ChengShenyang National Laboratory for Materials Science, Institute of Metal Research, CASVerified email at imr.ac.cn
- Kamal AlamehEdith Cowan UniversityVerified email at ecu.edu.au
- Wallace C.H. ChoyDepartment of Electrical and Electronic Engineering, the University of Hong KongVerified email at eee.hku.hk
- Fengxian XIEFudan UniversityVerified email at fudan.edu.cn
- Yuting LuoUniversity of TorontoVerified email at tsinghua.org.cn
- Wei E. I. ShaAssociate Professor, Zhejiang UniversityVerified email at zju.edu.cn
- Xuanhua LiWuhan University of Techonology, USTC, the University of Hong KongVerified email at eee.hku.hk
- Zuoti XieGuangdong Technion-Israel Institute of Technology; University of Minnesota; Weizmann; FudanVerified email at gtiit.edu.cn
- Chang-Qin WuFudan UniversityVerified email at fudan.edu.cn
- Yang Yang (楊陽)The Tannas Jr. Chair Professor, UCLAVerified email at ucla.edu
- Jingbi You (游经碧)Professor, Institute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
- yiqiang zhanFudan UniversityVerified email at fudan.edu.cn
- Di ZHANGAssociate Professor, Dept. of Sustainable and Renewable Energy Engineering, University of SharjahVerified email at sharjah.ac.ae
- V. Alek DediuCNR-ISMN, Bologna, ItalyVerified email at cnr.it
- Ilaria BergentiISMN-CNR, researcherVerified email at cnr.it
- Bo WuNanjing Tech UniversityVerified email at njtech.edu.cn
- Xiaoqing ChenBeijing University of TechnologyVerified email at bjut.edu.cn
Follow
Baofu Ding (丁宝福)
SIAT Chinese Academy of Sciences,Tsinghua University, Fudan University, The University of Hong Kong
Verified email at eee.hku.hk