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Y T Cheng
Y T Cheng
National Yang Ming Chiao Tung University
Verified email at g2.nctu.edu.tw
Title
Cited by
Cited by
Year
Power consumption reduction scheme of magnetic microactuation using electroplated Cu–Ni nanocomposite
YW Huang, TY Chao, CC Chen, YT Cheng
Applied Physics Letters 90 (24), 2007
4352007
Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
YT Cheng, L Lin, K Najafi
Journal of microelectromechanical systems 9 (1), 3-8, 2000
3322000
Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
YT Cheng, WT Hsu, K Najafi, CTC Nguyen, L Lin
Journal of Microelectromechanical Systems 11 (5), 556-565, 2002
2822002
Process for making microstructures and microstructures made thereby
L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,232,150, 2001
1922001
Development of a flexible SU-8/PDMS-based antenna
CP Lin, CH Chang, YT Cheng, CF Jou
IEEE Antennas and wireless propagation letters 10, 1108-1111, 2011
1442011
A robust high-Q micromachined RF inductor for RFIC applications
JW Lin, CC Chen, YT Cheng
IEEE Transactions on Electron Devices 52 (7), 1489-1496, 2005
1132005
A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
YT Cheng, L Lin, K Najafi
Journal of Microelectromechanical Systems 10 (3), 392-399, 2001
1072001
Silicon chip carrier with conductive through-vias and method for fabricating same
D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ...
US Patent App. 11/242,221, 2006
922006
Microstructures
L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,436,853, 2002
862002
Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments
L Lin, YT Cheng, CJ Chiu
Microsystem Technologies 4, 113-116, 1998
831998
Formation of silicon-gold eutectic bond using localized heating method
LLL Lin, YTCYT Cheng, KNK Najafi
Japanese journal of applied physics 37 (11B), L1412, 1998
741998
Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications
GR Shen, YT Cheng, LN Tsai
IEEE Transactions on Nanotechnology 4 (5), 539-547, 2005
562005
A low-power milliwatt electromagnetic microspeaker using a PDMS membrane for hearing aids application
YC Chen, YT Cheng
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011
442011
A low temperature wafer-level hermetic MEMS package using UV curable adhesive
ZH Liang, YT Cheng, W Hsu, YW Lee
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
432004
Localized bonding with PSG or indium solder as intermediate layer
YT Cheng, L Lin, K Najafi
Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE …, 1999
371999
Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite
LN Tsai, GR Shen, YT Cheng, W Hsu
Journal of Microelectromechanical Systems 15 (1), 149-158, 2006
352006
A capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosis
J Chen, X Cheng, CC Chen, PC Li, JH Liu, YT Cheng
Journal of microelectromechanical systems 17 (3), 599-610, 2008
342008
A 37.5-mW 8-dBm-EIRP 15.5-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration
CH Li, TY Chao, CW Lai, WC Chen, CL Ko, CN Kuo, YT Cheng, MC Kuo, ...
IEEE Transactions on Microwave Theory and Techniques 63 (2), 470-480, 2015
332015
The inductance enhancement study of spiral inductor using Ni–AAO nanocomposite core
MC Hsu, TY Chao, YT Cheng, CM Liu, C Chen
IEEE transactions on nanotechnology 8 (3), 281-285, 2009
312009
MEMS fabrication based on nickel-nanocomposite: film deposition and characterization
KS Teh, YT Cheng, L Lin
Journal of Micromechanics and Microengineering 15 (12), 2205, 2005
302005
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