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Y T Cheng
Y T Cheng
Verified email at g2.nctu.edu.tw
Title
Cited by
Cited by
Year
Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging
YT Cheng, L Lin, K Najafi
Journal of microelectromechanical systems 9 (1), 3-8, 2000
3232000
Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
YT Cheng, WT Hsu, K Najafi, CTC Nguyen, L Lin
Journal of Microelectromechanical Systems 11 (5), 556-565, 2002
2742002
Process for making microstructures and microstructures made thereby
L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,232,150, 2001
1682001
Development of a flexible SU-8/PDMS-based antenna
CP Lin, CH Chang, YT Cheng, CF Jou
IEEE Antennas and wireless propagation letters 10, 1108-1111, 2011
1172011
A robust high-Q micromachined RF inductor for RFIC applications
JW Lin, CC Chen, YT Cheng
IEEE Transactions on Electron Devices 52 (7), 1489-1496, 2005
1092005
A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
YT Cheng, L Lin, K Najafi
Journal of Microelectromechanical Systems 10 (3), 392-399, 2001
1002001
Silicon chip carrier with conductive through-vias and method for fabricating same
D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ...
US Patent App. 11/242,221, 2006
922006
Microstructures
L Lin, YT Cheng, K Najafi, KD Wise
US Patent 6,436,853, 2002
852002
Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments
L Lin, YT Cheng, CJ Chiu
Microsystem Technologies 4 (3), 113-116, 1998
791998
Formation of silicon-gold eutectic bond using localized heating method
LLL Lin, YTCYT Cheng, KNK Najafi
Japanese journal of applied physics 37 (11B), L1412, 1998
731998
Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications
GR Shen, YT Cheng, LN Tsai
IEEE Transactions on Nanotechnology 4 (5), 539-547, 2005
512005
A low temperature wafer-level hermetic MEMS package using UV curable adhesive
ZH Liang, YT Cheng, W Hsu, YW Lee
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
412004
Localized bonding with PSG or indium solder as intermediate layer
YT Cheng, L Lin, K Najafi
Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE …, 1999
381999
A low-power milliwatt electromagnetic microspeaker using a PDMS membrane for hearing aids application
YC Chen, YT Cheng
2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011
352011
A capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosis
J Chen, X Cheng, CC Chen, PC Li, JH Liu, YT Cheng
Journal of microelectromechanical systems 17 (3), 599-610, 2008
332008
Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite
LN Tsai, GR Shen, YT Cheng, W Hsu
Journal of microelectromechanical systems 15 (1), 149-158, 2006
332006
The inductance enhancement study of spiral inductor using Ni–AAO nanocomposite core
MC Hsu, TY Chao, YT Cheng, CM Liu, C Chen
IEEE transactions on nanotechnology 8 (3), 281-285, 2009
302009
Physical analysis of a biomimetic microphone with a central-supported (CS) circular diaphragm for sound source localization
CC Chen, YT Cheng
IEEE Sensors Journal 12 (5), 1504-1512, 2011
282011
MEMS fabrication based on nickel-nanocomposite: film deposition and characterization
KS Teh, YT Cheng, L Lin
Journal of Micromechanics and Microengineering 15 (12), 2205, 2005
282005
Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding
YT Cheng, L Lin, K Najafi
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000
282000
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Articles 1–20