| Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging YT Cheng, L Lin, K Najafi Journal of microelectromechanical systems 9 (1), 3-8, 2000 | 323 | 2000 |
| Vacuum packaging technology using localized aluminum/silicon-to-glass bonding YT Cheng, WT Hsu, K Najafi, CTC Nguyen, L Lin Journal of Microelectromechanical Systems 11 (5), 556-565, 2002 | 274 | 2002 |
| Process for making microstructures and microstructures made thereby L Lin, YT Cheng, K Najafi, KD Wise US Patent 6,232,150, 2001 | 168 | 2001 |
| Development of a flexible SU-8/PDMS-based antenna CP Lin, CH Chang, YT Cheng, CF Jou IEEE Antennas and wireless propagation letters 10, 1108-1111, 2011 | 117 | 2011 |
| A robust high-Q micromachined RF inductor for RFIC applications JW Lin, CC Chen, YT Cheng IEEE Transactions on Electron Devices 52 (7), 1489-1496, 2005 | 109 | 2005 |
| A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding YT Cheng, L Lin, K Najafi Journal of Microelectromechanical Systems 10 (3), 392-399, 2001 | 100 | 2001 |
| Silicon chip carrier with conductive through-vias and method for fabricating same D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ... US Patent App. 11/242,221, 2006 | 92 | 2006 |
| Microstructures L Lin, YT Cheng, K Najafi, KD Wise US Patent 6,436,853, 2002 | 85 | 2002 |
| Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments L Lin, YT Cheng, CJ Chiu Microsystem Technologies 4 (3), 113-116, 1998 | 79 | 1998 |
| Formation of silicon-gold eutectic bond using localized heating method LLL Lin, YTCYT Cheng, KNK Najafi Japanese journal of applied physics 37 (11B), L1412, 1998 | 73 | 1998 |
| Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications GR Shen, YT Cheng, LN Tsai IEEE Transactions on Nanotechnology 4 (5), 539-547, 2005 | 51 | 2005 |
| A low temperature wafer-level hermetic MEMS package using UV curable adhesive ZH Liang, YT Cheng, W Hsu, YW Lee 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 41 | 2004 |
| Localized bonding with PSG or indium solder as intermediate layer YT Cheng, L Lin, K Najafi Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE …, 1999 | 38 | 1999 |
| A low-power milliwatt electromagnetic microspeaker using a PDMS membrane for hearing aids application YC Chen, YT Cheng 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems …, 2011 | 35 | 2011 |
| A capacitive micromachined ultrasonic transducer array for minimally invasive medical diagnosis J Chen, X Cheng, CC Chen, PC Li, JH Liu, YT Cheng Journal of microelectromechanical systems 17 (3), 599-610, 2008 | 33 | 2008 |
| Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite LN Tsai, GR Shen, YT Cheng, W Hsu Journal of microelectromechanical systems 15 (1), 149-158, 2006 | 33 | 2006 |
| The inductance enhancement study of spiral inductor using Ni–AAO nanocomposite core MC Hsu, TY Chao, YT Cheng, CM Liu, C Chen IEEE transactions on nanotechnology 8 (3), 281-285, 2009 | 30 | 2009 |
| Physical analysis of a biomimetic microphone with a central-supported (CS) circular diaphragm for sound source localization CC Chen, YT Cheng IEEE Sensors Journal 12 (5), 1504-1512, 2011 | 28 | 2011 |
| MEMS fabrication based on nickel-nanocomposite: film deposition and characterization KS Teh, YT Cheng, L Lin Journal of Micromechanics and Microengineering 15 (12), 2205, 2005 | 28 | 2005 |
| Fabrication and hermeticity testing of a glass-silicon package formed using localized aluminum/silicon-to-glass bonding YT Cheng, L Lin, K Najafi Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000 | 28 | 2000 |
