Follow
Gopal Jha
Gopal Jha
Avago Technologies, Qualcomm Technologies, Georgia Institute of Technology
Verified email at gatech.edu
Title
Cited by
Cited by
Year
System on package: miniaturization of the entire system
RR Tummala
McGraw-Hill Education, 2008
1762008
Nanopackaging: Nanotechnologies and electronics packaging
JE Morris
Nanopackaging, 1-44, 2018
1242018
Study of edge effect and multi-curvature in laser bending of AISI 304 stainless steel
GC Jha, AK Nath, SK Roy
Journal of Materials Processing Technology 197 (1-3), 434-438, 2008
362008
Coelectrodeposited solder composite films for advanced thermal interface materials
PM Raj, PR Gangidi, N Nataraj, N Kumbhat, GC Jha, R Tummala, N Brese
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013
132013
Effect of deposition temperature on the microstructure and electrical properties of Ba0.8Sr0.2TiO3 thin films deposited by radio-frequency magnetron sputtering
GC Jha, SK Ray, I Manna
Thin Solid Films 516 (10), 3416-3421, 2008
132008
Effect of annealing temperature on the structural and electrical properties of SrBi2Ta2O9 thin films for memory-based applications
G Jha, A Roy, A Dhar, I Manna, SK Ray
Physica B: Condensed Matter 400 (1), 33-37, 2007
132007
Electronic packaging with a variable thickness mold cap
CJ Healy, GC Jha, V Ramadoss
US Patent 8,753,926, 2014
102014
Through mold via relief gutter on molded laser package (mlp) packages
CJ Healy, GC Jha, M Aldrete
US Patent 9,313,881, 2016
72016
Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
G Mehrotra, G Jha, JD Goud, PM Raj, M Venkatesan, M Iyer, D Hess, ...
2008 58th Electronic Components and Technology Conference, 1410-1416, 2008
62008
Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials
GP Reddy, PM Raj, N Nataraj, PM Rajesh, G Jha, A Choudhury, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
52010
A novel electroless process for embedding a thin film resistor on the benzocyclobutene dielectric
SK Bhattacharya, MG Varadarajan, P Chahal, GC Jha, RR Tummala
Journal of electronic materials 36 (3), 242-244, 2007
52007
Hybrid Multilayer Substrate
V Ramadoss, GC Jha, CJ Healy, Q INCORPORATED
US Patent 8546921, 2,013, 2010
22010
Low Temperature (≪100°C) deposited pyrochlore films with high capacitance (200 nF/cm2), low loss (∼0.003) and low TCF (≪100 ppm/C) for integrating RF …
PM Raj, JH Hwang, HM Jung, M Kumar, G Jha, K Coulter, S Wellinghoff, ...
2008 58th Electronic Components and Technology Conference, 688-693, 2008
12008
Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging
GC Jha, SK Bhattacharya, RR Tummala
Nanopackaging, 163-188, 2008
12008
Inductors: Micro-to Nanoscale Embedded Thin Power Inductors
PM Raj, GC Jha, S Teng, H Sharma, SK Bhattacharya, RR Tummala
Nanopackaging, 311-343, 2018
2018
Electrical properties of SrBi {sub 2} Ta {sub 2} O {sub 9} thin films deposited on Si (100) substrates by rf magnetron sputtering
A Roy, G Jha, A Dhar, SK Ray, I Manna
Indian Journal of Engineering and Materials Sciences 15, 2008
2008
Effect of deposition temperature on the microstructure and electrical properties of Ba {sub 0.8} Sr {sub 0.2} TiO {sub 3} thin films deposited by radio-frequency magnetron …
GC Jha, SK Ray, I Manna
Thin Solid Films 516, 2008
2008
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
GC Jha
Georgia Institute of Technology, 2008
2008
Electrical properties of SrBi₂Ta₂O₉ thin films deposited on Si (100) substrates by rf magnetron sputtering
A Roy, G Jha, A Dhar, I Manna, SK Ray
CSIR, 2008
2008
Effect of annealing temperature on the structural and electrical properties of SrBi {sub 2} Ta {sub 2} O {sub 9} thin films for memory-based applications
G Jha, A Roy, A Dhar, I Manna, SK Ray
Physica. B, Condensed Matter 400, 2007
2007
The system can't perform the operation now. Try again later.
Articles 1–20