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Co-authors
- Wim BogaertsGhent UniversityVerified email at ugent.be
- Niels QuackThe University of SydneyVerified email at sydney.edu.au
- Alain Yuji TakabayashiEnlightraVerified email at enlightra.com
- Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of TechnologyVerified email at kth.se
- Peter VerheyenVerified email at imec.be
- Pierre EdingerPostdoctoral researcher, KTH Royal Institute of TechnologyVerified email at kth.se
- Yufei XingBeeplux SemiconductorVerified email at beeplux.cn
- Hamed SattariCSEMVerified email at csem.ch
- Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, SwedenVerified email at kth.se
- Moises A. JezziniProduct Engineer, Meta Reality LabsVerified email at tyndall.ie
- Cleitus AntonyResearcher, Tyndall National Institute, Cork, IrelandVerified email at tyndall.ie
- Carlos Errando-HerranzTU DelftVerified email at tudelft.nl
- B. CorbettTyndallVerified email at tyndall.ie
- Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of TechnologyVerified email at kth.se
- Giuseppe TalliHuawei Technologies GmbH, DeutschlandVerified email at huawei.com
- Xiangfeng ChenGhent University - imecVerified email at ugent.be
- Arun Kumar MallikSenior Engineer , Photonics Packaging Group,Tyndall National InstituteVerified email at tyndall.ie
- Jeroen BeeckmanGhent UniversityVerified email at ugent.be
- Saurav KumarimecVerified email at imec.be
- Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenVerified email at ee.kth.se
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Muhammad Umar Khan
Other namesUmar Khan
Product Manager, Keysight Technologies
Verified email at keysight.com