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Co-authors
Harry M. Meyer IIIOak Ridge National LaboratoryVerified email at ornl.gov- Derrick Matthew Poirier3MVerified email at mmm.com
- John JoyceLos Alamos National Laboratory (retired)Verified email at lanl.gov
- Scott ChambersPacific Northwest National LaboratoryVerified email at pnnl.gov
- George WaddillPhysics, Missouri University of science & technologyVerified email at umsystem.edu
- Renzo RoseiUniversità degli Studi di TriesteVerified email at elettra.trieste.it
- José Luís MartinsPhysics Department, Instituto Superior Técnico, Universidade de Lisboa, PortugalVerified email at tecnico.ulisboa.pt
- Federico BoscheriniDepartment of Physics and Astronomy, University of BolognaVerified email at unibo.it
- Giorgio MargaritondoProfessor Emeritus EPFLVerified email at epfl.ch
- Maarten Vosresearch fellow, Australian National UniversityVerified email at anu.edu.au
- Jay CheyIBMVerified email at us.ibm.com
- Atsushi FujimoriUniversity of Tokyo & National Tsing Hua UniversityVerified email at phys.s.u-tokyo.ac.jp
- M CroftPhysics Department Rutgers UniversityVerified email at physics.rutgers.edu
- Xuesen WangNational University of SingaporeVerified email at nus.edu.sg
- Martin KnupferIFW DresdenVerified email at ifw-dresden.de
- Parasuraman SwaminathanProfessor, Electronic Materials and Thin Films Lab, Dept. of Metallurgical and MaterialsVerified email at iitm.ac.in
- Shaista BabarIntel CorporationVerified email at intel.com
- Elton GraugnardBoise State University, Micron School of Materials Science and EngineeringVerified email at boisestate.edu
- James R. ChelikowskyW.A. "Tex" Moncrief, Jr. Chair of Computational Materials, University of TexasVerified email at utexas.edu
- C. Barry CarterUConnVerified email at uconn.edu
