Peter Borgesen
Peter Borgesen
Professor of Systems Science & Industrial Engineering, Binghamton University
Verified email at - Homepage
Cited by
Cited by
Stress evolution due to electromigration in confined metal lines
MA Korhonen, P Borgesen, KN Tu, CY Li
Journal of Applied Physics 73 (8), 3790-3799, 1993
Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder
LP Lehman, SN Athavale, TZ Fullem, AC Giamis, RK Kinyanjui, ...
Journal of Electronic Materials 33 (12), 1429-1439, 2004
The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure
A Zribi, A Clark, L Zavalij, P Borgesen, EJ Cotts
Journal of Electronic Materials 30 (9), 1157-1164, 2001
Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
MA Korhonen, P Borgesen, DD Brown, CY Li
Journal of applied physics 74 (8), 4995-5004, 1993
Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigue
L Yin, L Wentlent, L Yang, B Arfaei, A Oasaimeh, P Borgesen
Journal of electronic materials 41 (2), 241-252, 2012
Interconnect structures containing blocked segments to minimize stress migration and electromigration damage
CY Li, P Borgesen, MA Korhonen
US Patent 5,439,731, 1995
On the root cause of Kirkendall voiding in Cu3Sn
L Yin, P Borgesen
Journal of Materials Research 26 (3), 455, 2011
Thermal‐stress‐induced voiding in narrow, passivated Cu lines
P Bo/rgesen, JK Lee, R Gleixner, CY Li
Applied physics letters 60 (14), 1706-1708, 1992
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface
Y Liu, J Wang, L Yin, P Kondos, C Parks, P Borgesen, DW Henderson, ...
Journal of applied electrochemistry 38 (12), 1695-1705, 2008
Do thermal spikes contribute to the ion‐induced mixing of Ni into Zr, Ti, and Pd?
P Borgesen, DA Lilienfeld, HH Johnson
Applied Physics Letters 57 (14), 1407-1409, 1990
Depth profiling by ion-beam spectrometry
P Borgesen, R Behrisch, BMU Scherzer
Applied Physics A 27 (4), 183-195, 1982
Pb-free solder: New materials considerations for microelectronics processing
P Borgesen, T Bieler, LP Lehman, EJ Cotts
MRS bulletin 32 (4), 360-365, 2007
The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints
B Arfaei, Y Xing, J Woods, J Wolcott, P Tumne, P Borgesen, E Cotts
2008 58th Electronic Components and Technology Conference, 459-465, 2008
Classifying the dimensional variation in additive manufactured parts from laser-scanned three-dimensional point cloud data using machine learning approaches
M Samie Tootooni, A Dsouza, R Donovan, PK Rao, ZJ Kong, P Borgesen
Journal of Manufacturing Science and Engineering 139 (9), 2017
Beam-Solid Interactions: Physical Phenomena
JA Knapp, P Børgesen, RA Zuhr
Materials Research Society Symposium Proceedings 157, 1990
Stress‐migration related electromigration damage mechanism in passivated, narrow interconnects
CY Li, P Borgesen, TD Sullivan
Applied physics letters 59 (12), 1464-1466, 1991
Stress‐induced nucleation of voids in narrow aluminum‐based metallizations on silicon substrates
MA Korhonen, WR LaFontaine, P Borgesen, CY Li
Journal of applied physics 70 (11), 6774-6781, 1991
Electronic sputtering of solid nitrogen and oxygen by keV electrons
O Ellegaard, J Schou, H Sørensen, P Børgesen
Surface science 167 (2-3), 474-492, 1986
Thermal and ion-induced release of hydrogen atoms implanted into graphite
W Möller, P Borgesen, BMU Scherzer
NIMPB 19, 826-831, 1987
Thermal and ion-induced release of hydrogen atoms implanted into graphite
W Möller, P Borgesen, BMU Scherzer
NIMPB 19, 826-831, 1987
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