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Paul K ChuChair Professor of Materials Engineering, City University of Hong KongVerified email at cityu.edu.hk
Enrique LaverniaProfessor, Materials Science and Engineering, University of Ca, IrvineVerified email at uci.edu
Julie M SchoenungProfessor of Materials Science and EngineeringVerified email at uci.edu
Kelvin YeungDepartment of Orthopaedics and Traumatology, The University of Hong KongVerified email at hku.hk
Yunchang xin重庆大学Verified email at cqu.edu.cn
Troy D. ToppingAssociate Professor, California State University, SacramentoVerified email at csus.edu
Jonathan C.Y. ChungDept. of Physics & Materials Science, City University of Hong KongVerified email at cityu.edu.hk
Shuilin WUTianjin UniversityVerified email at tju.edu.cn
Jian LuoUniversity of California San DiegoVerified email at alum.mit.edu
Kaka MaColorado State UniversityVerified email at colostate.edu
Naixie ZhouUCSDVerified email at eng.ucsd.edu
Kenneth VecchioDistinguished Professor, Dept. of NanoEngineering, UC San DiegoVerified email at eng.ucsd.edu
Tyler HarringtonApple Inc.Verified email at apple.com
Joshua GildNRLVerified email at nrl.navy.mil
Hanry YangProcess Engineer, Keysight TechnologiesVerified email at keysight.com
Sicong JiangUniversity of California San DiegoVerified email at eng.ucsd.edu
Haiming WenAssociate Professor, Missouri University of Science and TechnologyVerified email at mst.edu
Yuanyao ZhangUniversity of California, San DiegoVerified email at eng.ucsd.edu
Lin JiangThermo Fisher ScientificVerified email at fei.com
Mingde QinGener8, LLC. & University of California, San DiegoVerified email at eng.ucsd.edu