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David A MullerProfessor of Applied and Engineering Physics, Cornell UniversityVerified email at cornell.edu
Arend van der ZandeDepartment of Mechanical Science and Engineering, University of Illinois at Urbana ChampaignVerified email at illinois.edu
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Daniel A. ChenetColumbia UniversityVerified email at columbia.edu
Paul McEuenProfessor of Physics, Cornell UniversityVerified email at cornell.edu
Jiwoong ParkUniversity of ChicagoVerified email at uchicago.edu
Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Kenji WatanabeNational Institute for Materials ScienceVerified email at nims.go.jp
Lei WangColumbia UniversityVerified email at columbia.edu
Lola BrownCornell UniversityVerified email at cornell.edu
Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
Philip KimHarvard UniversityVerified email at g.harvard.edu
Mark LevendorfHRLVerified email at hrl.com
Robert HovdenUniversity of MichiganVerified email at cornell.edu
Carlos S. Ruiz-VargasLumafield.comVerified email at cornell.edu
Joshua W. KevekLab Manager/Fault Isolation Engineer, IntelVerified email at cornell.edu
Cheol-Joo KimDepartment of Chemical Engineering, Pohang University of Science and TechnologyVerified email at cornell.edu
T.TaniguchiNational Institute for Materials ScienceVerified email at nims.go.jp
Inanc MericIntel Co.Verified email at intel.com
Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu
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Pinshane Y. Huang
Associate Professor of Materials Science, University of Illinois
Verified email at illinois.edu - Homepage