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Yosuke Hanawa
Yosuke Hanawa
Other names塙洋祐, Y. Hanawa, Yousuke Hanawa
SCREEN Holdings Co. Ltd.,
Verified email at screen.co.jp
Title
Cited by
Cited by
Year
Substrate treating apparatus and substrate treating method
Y Sasaki, Y Hanawa, S Nadahara, D Ueda, H Kitagawa, K Okumura
US Patent 10,153,181, 2018
172018
Substrate cleaning method and substrate cleaning apparatus
Y Sasaki, Y Hanawa, K Miya
US Patent 10,286,425, 2019
92019
Substrate treating method and substrate treating apparatus
Y Hanawa, Y Sasaki
US Patent 10,699,920, 2020
62020
Breakthrough of Sublimation Drying by Liquid Phase Deposition
Y Sasaki, Y Hanawa, M Otsuji, N Fujiwara, M Kato, Y Yamaguchi, ...
Solid State Phenomena 314, 172-177, 2021
42021
Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces
D Ueda, Y Hanawa, H Kitagawa, N Fujiwara, M Otsuji, H Takahashi, ...
Solid State Phenomena 314, 155-160, 2021
42021
Substrate treating method and substrate treating apparatus
Y Hanawa, Y Sasaki
US Patent App. 16/037,016, 2019
42019
Vapor supplying apparatus, vapor drying apparatus, vapor supplying method, and vapor drying method
Y Hanawa, K Miya
US Patent 9,976,804, 2018
42018
Multi-scale analysis for solidification of phase change materials (PCMs): Experiments and modeling
M Xu, Y Hanawa, S Akhtar, A Sakuma, J Zhang, J Yoshida, M Sanada, ...
International Journal of Heat and Mass Transfer 212, 124182, 2023
32023
Thermomechanical formulation of freezing point depression behavior of liquid on solid surface with nanostructure
Y Hanawa, Y Sasaki, S Uchida, T Funayoshi, M Otsuji, H Takahashi, ...
ASME International Mechanical Engineering Congress and Exposition 84591 …, 2020
32020
Substrate cleaning method and substrate cleaning apparatus
Y Hanawa, K Miya, Y Sasaki
US Patent 9,728,396, 2017
32017
Substrate processing method and substrate processing device
D Ueda, Y Sasaki, Y Hanawa, H Kitagawa
US Patent 11,897,009, 2024
22024
Substrate treating method and apparatus used therefor
Y Sasaki, Y Hanawa, S Kunieda
US Patent App. 17/893,750, 2023
12023
Model potential of dimer system and coherence length of electron injected by scanning tunneling microscope on Ge (0 0 1) surface
H Kawai, Y Yoshimoto, O Narikiyo, Y Hanawa, A Imamura
Surface science 602 (18), 3010-3017, 2008
12008
Substrate treating method, substrate treating apparatus and substrate treating liquid
S Kunieda, Y Sasaki, Y Hanawa
US Patent App. 18/452,977, 2024
2024
Substrate processing liquid for etching a metal layer, substrate processing method and substrate processing apparatus
D Ueda, Y Hanawa
US Patent 11,908,938, 2024
2024
Kinetics formulation for Two-Dimensional Growth Behavior of Water/Ice Interface on Si Substrate
Y Hanawa, J Zhang, AP Sasmito, M Xu, S Akhtar, M Mohit, J Yoshida, ...
Langmuir, 2024
2024
Learning device, information processing apparatus, substrate processing device, substrate processing system, learning method, recipe determination method and non-transitory …
Y Hanawa, Y Sasaki, S Kunieda
US Patent App. 17/878,242, 2023
2023
Substrate drying method and substrate drying apparatus
Y Hanawa, Y Sasaki
US Patent 11,158,523, 2021
2021
Substrate treating method and substrate treating apparatus
Y Hanawa, D Ueda, Y Sasaki
US Patent 11,133,175, 2021
2021
Substrate treating method, substrate treating liquid and substrate treating apparatus
Y Sasaki, Y Hanawa
US Patent 11,094,565, 2021
2021
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