| The Environmental Footprint of IC Production: Review, Analysis, and Lessons From Historical Trends T Pirson, TP Delhaye, AG Pip, G Le Brun, JP Raskin, D Bol IEEE Transactions on Semiconductor Manufacturing 36 (1), 56-67, 2022 | 18 | 2022 |
| Enhanced ultraviolet photoresponse in a graphene-gated ultra-thin Si-based photodiode G Li, N André, B Huet, T Delhaye, N Reckinger, LA Francis, L Liao, ... Journal of Physics D: Applied Physics 52 (24), 245101, 2019 | 13 | 2019 |
| Could unsustainable electronics support sustainability? N Moreau, T Pirson, G Le Brun, T Delhaye, G Sandu, A Paris, D Bol, ... Sustainability 13 (12), 6541, 2021 | 12 | 2021 |
| The environmental footprint of IC production: Meta-analysis and historical trends T Pirson, T Delhaye, A Pip, G Le Brun, JP Raskin, D Bol ESSDERC 2022-IEEE 52nd European Solid-State Device Research Conference …, 2022 | 10 | 2022 |
| New universal figure of merit for embedded Si piezoresistive pressure sensors TP Delhaye, N André, LA Francis, D Flandre IEEE Sensors Journal 21 (1), 213-221, 2020 | 9 | 2020 |
| Ultra-low-power SOI CMOS pressure sensor based on orthogonal PMOS gauges N André, TP Delhaye, MAK Jazairli, B Olbrechts, P Gérard, LA Francis, ... XXII IMEKO TC4 International Symposium and XX International Workshop on ADC …, 2017 | 9 | 2017 |
| High-efficiency wireless power transfer for mm-size biomedical implants TP Delhaye, N André, S Gilet, C Gimeno, LA Francis, D Flandre 2017 IEEE SENSORS, 1-3, 2017 | 5 | 2017 |
| Tuning Range Comparison between Different Planar Inductors Layouts on PCB S Kaziz, B Maamer, T Delhaye, F Tounsi, LA Francis, D Flandre 2020 IEEE International Conference on Design & Test of Integrated Micro …, 2020 | 3 | 2020 |
| One-day fast-prototyping process for functionalized membrane array on flexible substrate T Delhaye, C Ge, L Francis, E Cretu, D Flandre 45th International Conference on Micro & Nano Engineering, 2019 | 2 | 2019 |
| Macro-Modeling Library in Simscape for MEMS Pressure Sensors Based on Energy-Flow Paradigm TP Delhaye, D Flandre, LA Francis, E Cretu Symposium on "Design, Test, Integration and Packaging os MEMS/MOEMS", 2019 | 2 | 2019 |
| Low-power silicon strain sensor based on CMOS current reference topology N Roisin, TP Delhaye, N André, JP Raskin, D Flandre Sensors and Actuators A: Physical 339, 113491, 2022 | 1 | 2022 |
| Bottom-Up Life-Cycle Assessment of MEMS Piezoresistive Pressure Sensors TP Delhaye, G Le Brun, D Flandre, JP Raskin 2021 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS …, 2021 | 1 | 2021 |
| Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB S Stoukatch, N André, T Delhaye, F Dupont, JM Redouté, D Flandre 2020 IEEE SENSORS, 1-4, 2020 | 1 | 2020 |
| Strain sensor N Roisin, D Flandre, N André, T Delhaye | | 2023 |
| Improving MOSFET Piezoresistive Strain Gauges Limit of Detection Using Lock-In Principle TP Delhaye, N Roisin, N André, LA Francis, D Flandre 2021 IEEE Sensors, 1-4, 2021 | | 2021 |
| Enhancing Partial Discharge Detection by Tuning Residual Stresses in Ultrathin CMOS-compatible Multilayer Membranes for Resonant Frequency Control E Masarweh, N André, T Delhaye, L Francis, D Flandre Micro and Nano Engineering Conference, 2021 | | 2021 |
| Capteurs CMOS physiques & physiologiques flexibles et basse consommation D Flandre, N André, T Delhaye, L Francis, JP Raskin Ecole d'hiver Francophone sur les Technologies de Conception des Systèmes …, 2019 | | 2019 |
| Wearable physical & physiological low-power sensors D Flandre, N André, T Delhaye, T Walewyns, L Francis, WP Convergence Workshop at the 48th ESSDERC-ESSCIRC Conference 2018, 2018 | | 2018 |
Denis FlandreICTEAM, EPL, Université catholique de Louvain (UCL)Verified email at uclouvain.be
