| Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer L Wang, J Li, M Catalano, G Bai, N Li, J Dai, X Wang, H Zhang, J Wang, ... Composites Part A: Applied Science and Manufacturing 113, 76-82, 2018 | 91 | 2018 |
| High thermal conductivity of Cu-B/diamond composites prepared by gas pressure infiltration HZ Guangzhu Bai, Ning Li, Xitao Wang, Jinguo Wang, Moon J. Kim Journal of Alloys and Compounds, 2017 | 87* | 2017 |
| Tailoring interface structure and enhancing thermal conductivity of Cu/ diamond composites by alloying boron to the Cu matrix HZ Guangzhu Bai, Luhua Wang, Yongjian Zhang, Xitao Wang, Jinguo Wang, Moon J ... Materials Characterization 152, 265–275, 2019 | 72 | 2019 |
| Interfacial structure evolution and thermal conductivity of Cu-Zr/diamond composites prepared by gas pressure infiltration L Wang, J Li, G Bai, N Li, X Wang, H Zhang, J Wang, MJ Kim Journal of Alloys and Compounds 781, 800-809, 2019 | 60 | 2019 |
| Precise control of versatile microstructure and properties of graphene aerogel via freezing manipulation X Zhu, C Yang, P Wu, Z Ma, Y Shang, G Bai, X Liu, G Chang, N Li, J Dai, ... Nanoscale 12 (8), 4882-4894, 2020 | 55 | 2020 |
| Effects of the addition of lanthanum and ultrasonic stirring on the microstructure and mechanical properties of the in situ Mg2Si/Al composites G Bai, Z Liu, J Lin, Z Yu, Y Hu, C Wen Materials & Design 90, 424-432, 2016 | 41 | 2016 |
| Tunable coefficient of thermal expansion of Cu-B/diamond composites prepared by gas pressure infiltration G Bai, Y Zhang, J Dai, L Wang, X Wang, J Wang, MJ Kim, X Chen, ... Journal of Alloys and Compounds 794, 473-481, 2019 | 23 | 2019 |
| Reinforcement size effect on thermal conductivity in Cu-B/diamond composite Y Zhang, G Bai, X Liu, J Dai, X Wang, H Zhang Journal of Materials Science & Technology 91, 1-4, 2021 | 22 | 2021 |
| Effect of ultrasonic stirring on the microstructure and mechanical properties of in situ Mg2Si/Al composite J Lin, G Bai, Z Liu, L Niu, G Li, C Wen Materials Chemistry and Physics 178, 112-118, 2016 | 20 | 2016 |
| Unveiling interfacial structure and improving thermal conductivity of Cu/diamond composites reinforced with Zr-coated diamond particles L Wang, G Bai, N Li, L Gao, J Li, K Xu, X Wang, H Zhang, J Wang, MJ Kim Vacuum 202, 111133, 2022 | 17 | 2022 |
| Microstructure and thermal conductivity of AlN coating on Cu substrate deposited by arc ion plating Y Zhang, J Dai, G Bai, H Zhang Materials Chemistry and Physics 241, 122374, 2020 | 17 | 2020 |
| High-temperature thermal conductivity and thermal cycling behavior of Cu–B/diamond composites GZ Bai, YJ Zhang, XY Liu, JJ Dai, XT Wang, HL Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 16 | 2019 |
| Manipulating in-situ discrete carbide interlayer to achieve high thermal conductivity in Cu-B/diamond composite Y Zhang, G Bai, X Zhu, J Dai, X Wang, J Wang, MJ Kim, H Zhang Materials Today Communications 34, 105357, 2023 | 12 | 2023 |
| Mechanical properties of Cu-B/diamond composites prepared by gas pressure infiltration G Bai, Y Zhang, J Dai, X Wang, H Zhang Journal of Materials Engineering and Performance 29, 3107-3119, 2020 | 7 | 2020 |
| Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface X Liu, F Sun, W Wang, J Zhao, L Wang, Z Che, G Bai, X Wang, J Wang, ... International Journal of Minerals, Metallurgy and Materials 29 (11), 2020-2031, 2022 | 4 | 2022 |
| 超声波搅拌时间对原位自生Mg2Si/Al基复合材料凝固组织和力学性能的影响 白光珠， 余昭福， 刘政 有色金属材料与工程, 2016 | 4 | 2016 |
| 电磁搅拌频率对半固态 A356 铝合金初生 α 相和铈分布的影响 刘政， 罗浩林， 白光珠 中国稀土学报 33 (3), 328-335, 2015 | 4 | 2015 |
| La 对原位自生 Mg_2Si/Al 复合材料组织及性能的影响 刘政， 白光珠， 徐丽娜， 余昭福 特种铸造及有色合金 35 (9), 897-901, 2015 | 4 | 2015 |
| Y对原位Mg2Si/Al基复合材料初生相Mg2Si的细化机制 刘政， 白光珠， 罗浩林 有色金属科学与工程, 2016 | 3 | 2016 |
| 铝粉粒径对铝电解电容器用烧结箔孔隙及 电性能的影响. 王立强， 胥珊娜， 王海丽， 张于胜， 白光珠 Electronic Components & Materials 41 (5), 2022 | 2 | 2022 |
Xitao WangUniversity of Science and Technology BeijingVerified email at ustb.edu.cn
