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Co-authors
- Darrell G. SchlomCornell UniversityVerified email at cornell.edu
- Xingxu Yan (闫星旭)University of California, IrvineVerified email at uci.edu
- mingjie xuIrvine Material Research Institute. University of California, IrvineVerified email at uci.edu
- Chang-Beom EomUniversity of Wisconsin-MadisonVerified email at engr.wisc.edu
- Long-Qing ChenPenn StateVerified email at psu.edu
- Sheng Dai (戴升)East China University of Science and TechnologyVerified email at ecust.edu.cn
- Seung Hyub BaekKorea Institute of Science and Technology (KIST)Verified email at kist.re.kr
- Prof Peng WangUniversity of WarwickVerified email at warwick.ac.uk
- Linze LiTEM engineer @ Micron Tech. Realtor®.Verified email at micron.com
- Haiping SunUniversity of MichiganVerified email at umich.edu
- R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
- Peng GAO (高鹏)International Center for Quantum Materials, and Electron Microscopy Laboratory, Peking UniversityVerified email at pku.edu.cn
- Chaitanya GadreGraduate Student ResearcherVerified email at uci.edu
- Shuyi ZhangUniversity of MichiganVerified email at umich.edu
- Lin XieSouthern University of Science and TechnologyVerified email at sustech.edu.cn
- Mark RzchowskiProfessor of Physics, University of Wisconsin-MadisonVerified email at wisc.edu
- Ruqian WuUniversity of California, IrvineVerified email at uci.edu
- Yuefeng NieNanjing UniversityVerified email at nju.edu.cn
- Ho Won JangDepatment of Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
- Huaixun HuyanHardware development Engineer, Western DigitalVerified email at wdc.com