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Zlatan AksamijaAssociate Professor, Materials Science and Engineering, University of UtahVerified email at utah.edu- Edwin Bosco RamayyaThermo Mechanical Modeling Group, Intel CorporationVerified email at intel.com
- Susan HagnessPhilip D Reed Professor of Electrical and Computer Engineering, University of Wisconsin-MadisonVerified email at engr.wisc.edu
- Dragica VasileskaArizona State UniversityVerified email at asu.edu
- Max G. LagallyMaterials Science and Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
- D. BotezPhilip Dunham Reed Professor, University of Wisconsin-MadisonVerified email at engr.wisc.edu
- Amirhossein DavoodyIntel Inc.Verified email at intel.com
- Song MeiUniversity of Wisconsin MadisonVerified email at wisc.edu
- Farhad KarimiMicrosoft Station Q at Santa BarbaraVerified email at microsoft.com
- Leon N MaurerVerified email at wisc.edu
- Mark A. ErikssonJohn Bardeen Professor of Physics, Department of Physics, University of Wisconsin-MadisonVerified email at wisc.edu
- DONALD SAVAGEUniversity of WisconsinVerified email at wisc.edu
- Paul EvansProfessor, Materials Science and EngineeringVerified email at wisc.edu
- George K CellerProfessor of Materials Science, Rutgers UniversityVerified email at rci.rutgers.edu
- Yanbing ShiUniversity of Wisconsin-MadisonVerified email at wisc.edu
- Sina SoleimanikahnojUniversity of Wisconsin-MadisonVerified email at wisc.edu
- Weina PengUniversity of Texas at DallasVerified email at utdallas.edu
- Benjamin B. YangGeorgia Tech Research InstituteVerified email at gatech.edu
- Eric PopPease-Ye Professor of Electrical Engineering & Materials Science, Stanford UniversityVerified email at stanford.edu
- LUKE MAWSTUniversity of WisconsinVerified email at wisc.edu
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Irena Knezevic
Professor, Electrical and Computer Engineering, University of Wisconsin - Madison
Verified email at engr.wisc.edu - Homepage