| Comparative Study on Impact Of Various Low Creep Doped Lead Free Solder Alloys A Raj, S Sridhar, S Thirugnanasambandam, T Sanders, J Evans, ... SMTA International Proceedings, 820-826, 2017 | 20 | 2017 |
| Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloys S Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 20 | 2016 |
| Thermal Shock Reliability of Isothermally Aged Doped Lead-Free Solder with Semiparametric Estimation A Raj, T Sanders, S Sridhar, JL Evans, MJ Bozack, WR Johnson, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 19 | 2019 |
| Proportional Hazard Model of doped low creep lead free solder paste under thermal shock A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, S Gordon, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 19 | 2016 |
| Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing S Sridhar, A Raj, J Evans, M Bozack, W Johnson, S d Hamasha Proceedings of SMTA International, 562-567, 2017 | 16 | 2017 |
| The study of vibrational performance on different doped low creep lead free solder paste and solder ball grid array packages S Thirugnanasambandam, T Sanders, A Raj, D Stone, J Evans, G Flowers, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 12 | 2014 |
| Reliability of micro-alloyed SnAgCu Based solder interconnections for various harsh applications S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019 | 11 | 2019 |
| Reliability of Doped Ball Grid Array Components in Thermal Cycling after Long-Term Isothermal Aging S Gordon, S Thirugnanasambandam, T Sanders, A Raj, S Sridhar, ... Proceedings of SMTA International, 438-442, 2017 | 11 | 2017 |
| Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages A Raj, S Thirugnanasambandam, T Sanders, S Sridhar, J Evans, ... Proceedings of SMTA International, 354-361, 2015 | 11 | 2015 |
| Proportional Hazard Model of doped low creep lead free solder paste under vibration S Thirugnanasambandam, A Raj, D Stone, T Sanders, S Sridhar, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 10 | 2016 |
| Assembly options and challenges for electronic products with lead-free exemption CM Huang, A Raj, M Osterman, M Pecht IEEE Access 8, 134194-134208, 2020 | 9 | 2020 |
| Long Term Isothermal Aging of BGA Packages Using Doped Lead Free Solder Alloys A Raj, S Sridhar, S Gordon, J Evans, M Bozack, W Johnson Proceedings of SMTA International, 2018 | 9 | 2018 |
| The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints R Coyle, M Anselm, F Hadian, S Kempaiah, A Raj, R Popowich, L Clark, ... Proceedings of SMTA International, 386-399, 2021 | 4 | 2021 |
| Isothermal Aging Effects of Doped Lead-Free Solder Performance in Super BGA Package A Raj, S Thirugnanasambandam, J Evans Proceedings of International Conference for Electronics Enabling Technologies, 2018 | 3 | 2018 |
| Interim Thermal Cycling Report on Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Joints R Coyle, R Aspandiar, F Hadian, S Kempaiah, V Vasudevan, A Allen, ... Proceedings of SMTA International, 400-425, 2021 | 1 | 2021 |
| The Effects of Aging on Doped Lead-Free Solder under Thermal Shock and Thermal Cycling A Raj Auburn University, 2019 | 1 | 2019 |
| Reliability Testing of Isothermally Aged Doped Low Creep Lead-Free Solder Paste Alloys Under Vibration and Shock Conditions S Sridhar, S Thirugnanasambandam, S Gordon, A Raj, T Sanders, ... Proceedings of SMTA International, 432-437, 2016 | 1 | 2016 |
| Degradation of Leadfree Solder Materials Subjected to Isothermal Aging with Use of the CABGA208 Package S Gordon, T Sanders, A Raj, CJ Evans, T Devall, G Harris, JL Evans 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2020 | | 2020 |
| Thermal Shock and Mechanical reliability Testing of Isothermally Aged, Doped Lead Free Solder Paste Alloys MC Seth Gordon, Anto Raj, Sharath Sridhar, Thomas Sanders, Sivasubramanian ... Proceedings of SMTA International, 426-431, 2016 | | 2016 |
