Michael Mayer
Michael Mayer
Associate Professor of Mechanical and Mechatronics Engineering, University of Waterloo
Verified email at
Cited by
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Method of source terms for dipole emission modification in modes of arbitrary planar structures
H Benisty, R Stanley, M Mayer
JOSA A 15 (5), 1192-1201, 1998
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
CJ Hang, CQ Wang, M Mayer, YH Tian, Y Zhou, HH Wang
Microelectronics reliability 48 (3), 416-424, 2008
Influence of superimposed ultrasound on deformability of Cu
H Huang, A Pequegnat, BH Chang, M Mayer, D Du, Y Zhou
Journal of Applied Physics 106 (11), 113514, 2009
Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate
I Lum, M Mayer, Y Zhou
Journal of electronic materials 35 (3), 433-442, 2006
Effects of superimposed ultrasound on deformation of gold
I Lum, H Huang, BH Chang, M Mayer, D Du, Y Zhou
Journal of Applied Physics 105 (2), 024905, 2009
Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
M Mayer, O Paul, D Bolliger, H Baltes
Components and Packaging Technologies, IEEE Transactions on 23 (2), 393-398, 2000
Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature
Y Tian, C Wang, I Lum, M Mayer, JP Jung, Y Zhou
Journal of Materials Processing Technology 208 (1), 179-186, 2008
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
Microelectronic Engineering 85 (9), 1851-1857, 2008
Thermosonic ball bonding: friction model based on integrated microsensor measurements
J Schwizer, M Mayer, D Bolliger, O Paul, H Baltes
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE …, 1999
Microelectronic bonding process monitoring by integrated sensors
M Mayer
Diss., Technische Wissenschaften ETH Zürich, Nr. 13685, 2000, 2000
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force
CJ Hang, WH Song, I Lum, M Mayer, Y Zhou, CQ Wang, JT Moon, ...
Microelectronic engineering 86 (10), 2094-2103, 2009
Low-stress thermosonic copper ball bonding
A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon
IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009
Microstructural study of copper free air balls in thermosonic wire bonding
CJ Hang, CQ Wang, YH Tian, M Mayer, Y Zhou
Microelectronic engineering 85 (8), 1815-1819, 2008
Force sensors for microelectronic packaging applications
J Schwizer, M Mayer, O Brand
Springer, 2004
Influence of mechanical stress on the offset voltage of Hall devices operated with spinning current method
R Steiner, C Maier, M Mayer, S Bellekom, H Baltes
Journal of microelectromechanical systems 8 (4), 466-472, 1999
In situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors
M Mayer, J Schwizer, O Paul, D Bolliger, H Baltes
Advances in Electronic Packaging, EEP 26 (1), 973-978, 1999
Ultrasonic friction power during Al wire wedge-wedge bonding
A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou
Journal of applied physics 106 (1), 013503, 2009
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon
Microelectronics Reliability 51 (1), 67-74, 2011
Bonding wire characterization using automatic deformability measurement
CJ Hang, I Lum, J Lee, M Mayer, CQ Wang, Y Zhou, SJ Hong, SM Lee
Microelectronic Engineering 85 (8), 1795-1803, 2008
Role of process parameters on bondability and pad damage indicators in copper ball bonding
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
Microelectronics Reliability 51 (1), 60-66, 2011
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