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Michael Mayer
Michael Mayer
Associate Professor of Mechanical and Mechatronics Engineering, University of Waterloo
Verified email at uwaterloo.ca
Title
Cited by
Cited by
Year
Method of source terms for dipole emission modification in modes of arbitrary planar structures
H Benisty, R Stanley, M Mayer
JOSA A 15 (5), 1192-1201, 1998
3181998
Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging
CJ Hang, CQ Wang, M Mayer, YH Tian, Y Zhou, HH Wang
Microelectronics reliability 48 (3), 416-424, 2008
2822008
Influence of superimposed ultrasound on deformability of Cu
H Huang, A Pequegnat, BH Chang, M Mayer, D Du, Y Zhou
Journal of Applied Physics 106 (11), 113514, 2009
902009
Footprint study of ultrasonic wedge-bonding with aluminum wire on copper substrate
I Lum, M Mayer, Y Zhou
Journal of electronic materials 35 (3), 433-442, 2006
862006
Effects of superimposed ultrasound on deformation of gold
I Lum, H Huang, BH Chang, M Mayer, D Du, Y Zhou
Journal of Applied Physics 105 (2), 024905, 2009
732009
Integrated temperature microsensors for characterization and optimization of thermosonic ball bonding process
M Mayer, O Paul, D Bolliger, H Baltes
Components and Packaging Technologies, IEEE Transactions on 23 (2), 393-398, 2000
662000
Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature
Y Tian, C Wang, I Lum, M Mayer, JP Jung, Y Zhou
Journal of Materials Processing Technology 208 (1), 179-186, 2008
612008
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
Microelectronic Engineering 85 (9), 1851-1857, 2008
612008
Thermosonic ball bonding: friction model based on integrated microsensor measurements
J Schwizer, M Mayer, D Bolliger, O Paul, H Baltes
Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE …, 1999
571999
Microelectronic bonding process monitoring by integrated sensors
M Mayer
Diss., Technische Wissenschaften ETH Zürich, Nr. 13685, 2000, 2000
502000
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force
CJ Hang, WH Song, I Lum, M Mayer, Y Zhou, CQ Wang, JT Moon, ...
Microelectronic engineering 86 (10), 2094-2103, 2009
492009
Low-stress thermosonic copper ball bonding
A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon
IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009
482009
Microstructural study of copper free air balls in thermosonic wire bonding
CJ Hang, CQ Wang, YH Tian, M Mayer, Y Zhou
Microelectronic engineering 85 (8), 1815-1819, 2008
462008
Force sensors for microelectronic packaging applications
J Schwizer, M Mayer, O Brand
Springer, 2004
462004
Influence of mechanical stress on the offset voltage of Hall devices operated with spinning current method
R Steiner, C Maier, M Mayer, S Bellekom, H Baltes
Journal of microelectromechanical systems 8 (4), 466-472, 1999
461999
In situ ultrasonic stress measurements during ball bonding using integrated piezoresistive microsensors
M Mayer, J Schwizer, O Paul, D Bolliger, H Baltes
Advances in Electronic Packaging, EEP 26 (1), 973-978, 1999
451999
Ultrasonic friction power during Al wire wedge-wedge bonding
A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou
Journal of applied physics 106 (1), 013503, 2009
422009
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon
Microelectronics Reliability 51 (1), 67-74, 2011
382011
Bonding wire characterization using automatic deformability measurement
CJ Hang, I Lum, J Lee, M Mayer, CQ Wang, Y Zhou, SJ Hong, SM Lee
Microelectronic Engineering 85 (8), 1795-1803, 2008
372008
Role of process parameters on bondability and pad damage indicators in copper ball bonding
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
Microelectronics Reliability 51 (1), 60-66, 2011
332011
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Articles 1–20