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Co-authors
Nian LiuGeorgia Institute of TechnologyVerified email at chbe.gatech.edu- Yuan YangColumbia University, MIT, StanfordVerified email at columbia.edu
- Wesley G ZhengStanford UniversityVerified email at nus.edu.sg
- Yayuan LiuJohns Hopkins UniversityVerified email at jhu.edu
- Dingchang LinJohns Hopkins UniversityVerified email at jhu.edu
- Po-Chun HsuThe University of ChicagoVerified email at uchicago.edu
- judy j. chaProfessor, Materials Science and Engineering, Cornell UniversityVerified email at cornell.edu
- Haotian WangRice UniversityVerified email at rice.edu
- Hyun-Wook LeeEnergy and Chemical Engineering, UNISTVerified email at unist.ac.kr
- Yuzhang LiAssistant Professor, Chemical and Biomolecular Engineering, University of California, Los AngelesVerified email at ucla.edu
- Matthew T. McDowellAssociate Professor, Georgia Institute of TechnologyVerified email at gatech.edu
- Hui WuTsinghua UniversityVerified email at mail.tsinghua.edu.cn
- DESHENG KONGProfessor, College of Engineering and Applied Sciences, Nanjing UniversityVerified email at nju.edu.cn
- Kai Yan(剡剀)Peking University (Ph. D.), Stanford University (PostDoc)Verified email at stanford.edu
- Yongming Sun/孙永明Huazhong University of Science and TechnologyVerified email at hust.edu.cn
- Chong LiuAssistant Professor, University of ChicagoVerified email at uchicago.edu
- ZHAO JIE (赵婕)Fudan University, Stanford University (Ph.D.)Verified email at fudan.edu.cn
- Hailin PengProfessor at Physical Chemistry, Peking UniversityVerified email at pku.edu.cn
- Shanhui FanProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Mauro PastaUniversity of OxfordVerified email at materials.ox.ac.uk
