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Jimy Gomes
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Development of a fast method for optimization of Au ball bond process
J Gomes, M Mayer, B Lin
Microelectronics Reliability 55 (3-4), 602-607, 2015
152015
Accelerating reliability assessment with multi-oven racks and sensor chips for wire bonds
M Mayer, J Gomes
IMAPS New England Symposium, 2015
72015
Effect of bond geometry on shear strength and HTS reliability for Au ball bond on Al pad
J Gomes, M Mayer
IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016
62016
Thermal Aging Behavior of Fine Pitch Palladium Coated Silver (PCS) Ball Bonds on Al Metallization
DE Xu, J Gomes, M Mayer, R Lyn, J Persic
International Symposium on Microelectronics 2015 (1), 000298-000304, 2015
52015
Effect of Au ball bond geometry on bond strength and process parameters, and assessing reliability on Al bond pad using integrated stress sensors
J Gomes, M Mayer
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2127-2133, 2015
52015
A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization
J Gomes
University of Waterloo, 2015
12015
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