| A Fully Integrated 0.18- CMOS Transceiver Chip for -Band Phased-Array Systems K Gharibdoust, N Mousavi, M Kalantari, M Moezzi, A Medi IEEE Transactions on Microwave Theory and Techniques 60 (7), 2192-2202, 2012 | 81 | 2012 |
| A 1.02-pJ/b 20.83-Gb/s/wire USR transceiver using CNRZ-5 in 16-nm FinFET A Tajalli, MB Parizi, DA Carnelli, C Cao, K Gharibdoust, D Gorret, A Gupta, ... IEEE Journal of Solid-State Circuits 55 (4), 1108-1123, 2020 | 34 | 2020 |
| Hybrid NRZ/multi-tone serial data transceiver for multi-drop memory interfaces K Gharibdoust, A Tajalli, Y Leblebici IEEE Journal of Solid-State Circuits 50 (12), 3133-3144, 2015 | 33 | 2015 |
| 10.3 A 7.5 mW 7.5 Gb/s mixed NRZ/multi-tone serial-data transceiver for multi-drop memory interfaces in 40nm CMOS K Gharibdoust, A Tajalli, Y Leblebici International Solid-State Circuits Conference (ISSCC) 2015, 180-181, 2015 | 25 | 2015 |
| Passive multi-input comparator for orthogonal codes on a multi-wire bus A Tajalli, C Cao, K Gharibdoust US Patent 10,742,451, 2020 | 21 | 2020 |
| A 4×9Gb/s 1pJ/b Hybrid NRZ/Multi-Tone I/O with Crosstalk and ISI Reduction for Dense Interconnects K Gharibdoust, SA Tajalli, Y Leblebici IEEE Journal of Solid State Circuits (JSSC) 51 (4), 992-1002, 2016 | 18* | 2016 |
| Measurement and correction of multiphase clock duty cycle and skew MA Ashtiani, K Gharibdoust US Patent 10,630,272, 2020 | 16 | 2020 |
| Amplifier with adjustable high-frequency gain using varactor diodes S Rattan, K Gharibdoust US Patent 10,931,249, 2021 | 11 | 2021 |
| A 1.02 pJ/b 417Gb/s/mm USR link in 16nm FinFET A Tajalli, M Bastani, D Carnelli, C Cao, J Fox, K Gharibdoust, D Gorret, ... 2019 Symposium on VLSI Circuits, C92-C93, 2019 | 8 | 2019 |
| A 4× 9 Gb/s 1 pJ/b NRZ/multi-tone serial-data transceiver with crosstalk reduction architecture for multi-drop memory interfaces in 40nm CMOS K Gharibdoust, A Tajalli, Y Leblebici 2015 Symposium on VLSI Circuits (VLSI Circuits), 2015 | 7 | 2015 |
| Short-reach and pin-efficient interfaces using correlated NRZ A Tajalli, MB Parizi, DA Carnelli, C Cao, K Gharibdoust, A Gupta, ... 2020 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2020 | 6 | 2020 |
| A versatile spectrum shaping scheme for communicating beyond notches in multi-drop interfaces A Hormati, A Tajalli, C Walter, K Gharibdoust, A Shokrollahi Proceedings of DesignCon 2016, 2016 | 6 | 2016 |
| Thermo-electric Analogy Method for Computing Transient Heat Transfer In a New Reciprocating Finned Piston Compressor M Heidari, K Gharibdoust, A Rufer, JR Thome International Heat Transfer Conference Digital Library, 2014 | 6 | 2014 |
| Distributed electrostatic discharge protection for chip-to-chip communications interface K Gharibdoust, A Tajalli, C Walter US Patent App. 15/709,318, 2019 | 5 | 2019 |
| A Method for Noise Reduction in Active-Circuits K Gharibdoust, MS Bakhtiar IEEE Transactions on Circuits and Systems II: Express Briefs 58 (12), 906-910, 2011 | 4 | 2011 |
| A time-division multiplexing signaling scheme for inter-symbol/channel interference reduction in low-power multi-drop memory links G Kim, C Cao, K Gharibdoust, A Tajalli, Y Leblebici IEEE Transactions on Circuits and Systems II: Express Briefs 64 (12), 1387-1391, 2017 | 3 | 2017 |
| Design and modeling of serial data transceiver architecture by employing multi-tone single-sideband signaling scheme G Kim, T Barailler, C Cao, K Gharibdoust, Y Leblebici IEEE Transactions on Circuits and Systems I: Regular Papers 64 (12), 3192-3201, 2017 | 3 | 2017 |
| A digital spectrum shaping signaling serial-data transceiver with crosstalk and ISI reduction property in multidrop interfaces G Kim, K Gharibdoust, A Tajalli, Y Leblebici IEEE Transactions on Circuits and Systems II: Express Briefs 63 (12), 1126-1130, 2016 | 3 | 2016 |
| A fully-digital spectrum shaping signaling for serial-data transceiver with crosstalk and ISI reduction property in multi-drop memory interfaces K Gharibdoust, G Kim, A Tajalli, Y Leblebici 2016 IEEE International Symposium on Circuits and Systems (ISCAS), 2905-2905, 2016 | 3 | 2016 |
| Design and analysis of jitter-aware low-power and high-speed TSV link for 3D ICs G Beanato, K Gharibdoust, A Cevrero, G De Micheli, Y Leblebici Microelectronics Journal 48, 50-59, 2016 | 3 | 2016 |
