Improving the Thermomechanical Behavior of Lead Free Solder Joints by Controlling the Microstructure B Arfaei, L Wentlent, S Joshi, A Alazzam, T Tashtoush, M Halaweh, ... 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2012 | 40 | 2012 |
Optimization of Inventory Pick-up Time in a Server Manufacturing Environment S Chivukula, C Saha, B Schleich, N Nagarur, B Wassink Proceedings of the 2nd Annual World Conference, 9, 2013 | 2 | 2013 |
Estimating product assembly cost using an activity-based costing approach S Chivukula State University of New York at Binghamton, Thomas J. Watson School of …, 2011 | 2 | 2011 |
Issues and Challenges for Global Outsourcing efforts by Manufacturing Firms S Chivukula, D Santos Proceedings of the 3rd Annual World Conference, 10, 2014 | | 2014 |
Assembly line balancing for multi-model, small lot systems S Chivukula, D Santos, N Nagarur Proceedings of the 3rd Annual World Conference, 8, 2014 | | 2014 |