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Jianyong Xie
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Designing and modeling for power integrity
M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie
Electromagnetic Compatibility, IEEE Transactions on 52 (2), 288-310, 2010
1522010
Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects
J Xie, M Swaminathan
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
1102011
Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
B Xie, M Swaminathan, KJ Han, J Xie
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on, 16-21, 2011
412011
Electrical-thermal co-analysis for power delivery networks in 3D system integration
J Xie, D Chung, M Swaminathan, M Mcallister, A Deutsch, L Jiang, ...
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, 1-4, 2009
342009
Electrical–thermal cosimulation with nonconformal domain decomposition method for multiscale 3-D integrated systems
J Xie, M Swaminathan
Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014
332014
Vertical topologies of miniature multispiral stacked inductors
WY Yin, JY Xie, K Kang, J Shi, JF Mao, XW Sun
Microwave Theory and Techniques, IEEE Transactions on 56 (2), 475-486, 2008
312008
A rigorous model for through-silicon vias with ohmic contact in silicon interposer
DC Yang, J Xie, M Swaminathan, XC Wei, EP Li
Microwave and Wireless Components Letters, IEEE 23 (8), 385-387, 2013
222013
Electrical–thermal modeling of through‐silicon via (TSV) arrays in interposer
J Xie, B Xie, M Swaminathan
International Journal of Numerical Modelling: Electronic Networks, Devices …, 2013
182013
Simulation of power delivery networks with Joule heating effects for 3D integration
J Xie, M Swaminathan
Electronic System-Integration Technology Conference (ESTC), 2010 3rd, 1-6, 2010
162010
Fast electrical-thermal co-simulation using multigrid method for 3D integration
J Xie, M Swaminathan
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 651-657, 2012
142012
DC IR drop solver for large scale 3D power delivery networks
J Xie, M Swaminathan
Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 …, 2010
142010
3D transient thermal solver using non-conformal domain decomposition approach
J Xie, M Swaminathan
Proceedings of the International Conference on Computer-Aided Design, 333-340, 2012
112012
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
J Xie, D Chung, M Swaminathan, M Mcallister, A Deutsch, L Jiang, ...
Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS'09 …, 2009
92009
System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction
J Xie, M Swaminathan
Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014
82014
Electrical-thermal co-simulation with joule heating and convection effects for 3D systems
J Xie, M Swaminathan
US Patent 9,037,446, 2015
72015
Optimization of 3D stack for electrical and thermal integrity
R Bazaz, J Xie, M Swaminathan
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 22-28, 2013
72013
Wideband Circuit Model of Silicon-Based Interconnects Up to 50 GHz
G Luo, WY Yin, K Kang, JL Shi, JY Xie, JF Mao
Microwave Conference, 2007. APMC 2007. Asia-Pacific, 1-4, 2007
32007
Crosstalk reduction in TSV arrays with direct ohmic contact between metal and silicon-substrate
DC Yang, EP Li, L Jun, XC Wei, JY Xie, M Swaminathan
Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International …, 2014
22014
3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer
B Xie, M Swaminathan, KJ Han, J Xie
Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on, 1-4, 2014
22014
Computationally efficient thermal simulation with micro-fluidic cooling for 3D integration
J Xie, M Swaminathan
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 …, 2011
22011
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