| Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET N Loubet, T Hook, P Montanini, CW Yeung, S Kanakasabapathy, ... 2017 symposium on VLSI technology, T230-T231, 2017 | 768 | 2017 |
| A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ... 2016 IEEE international electron devices meeting (IEDM), 2.7. 1-2.7. 4, 2016 | 174 | 2016 |
| Molecular glass resists for high-resolution patterning J Dai, SW Chang, A Hamad, D Yang, N Felix, CK Ober Chemistry of materials 18 (15), 3404-3411, 2006 | 145 | 2006 |
| Sub-50 nm feature sizes using positive tone molecular glass resists for EUV lithography SW Chang, R Ayothi, D Bratton, D Yang, N Felix, HB Cao, H Deng, ... Journal of Materials Chemistry 16 (15), 1470-1474, 2006 | 110 | 2006 |
| Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond CC Liu, E Franke, Y Mignot, R Xie, CW Yeung, J Zhang, C Chi, C Zhang, ... Nature Electronics 1 (10), 562-569, 2018 | 102 | 2018 |
| Molecular Glass Resists as High‐Resolution Patterning Materials A De Silva, NM Felix, CK Ober Advanced Materials 20 (17), 3355-3361, 2008 | 99 | 2008 |
| Study of the Structure− Properties Relationship of Phenolic Molecular Glass Resists for Next Generation Photolithography A De Silva, JK Lee, X André, NM Felix, HB Cao, H Deng, CK Ober Chemistry of Materials 20 (4), 1606-1613, 2008 | 72 | 2008 |
| FINFET technology featuring high mobility SiGe channel for 10nm and beyond D Guo, G Karve, G Tsutsui, KY Lim, R Robison, T Hook, R Vega, D Liu, ... 2016 IEEE Symposium on VLSI Technology, 1-2, 2016 | 65 | 2016 |
| High‐Resolution Patterning of Molecular Glasses Using Supercritical Carbon Dioxide NM Felix, K Tsuchiya, CK Ober Advanced materials 18 (4), 442-446, 2006 | 59 | 2006 |
| Characterization of wafer geometry and overlay error on silicon wafers with nonuniform stress TA Brunner, VC Menon, CW Wong, O Gluschenkov, MP Belyansky, ... Journal of Micro/Nanolithography, MEMS, and MOEMS 12 (4), 043002-043002, 2013 | 55 | 2013 |
| Phenolic molecular glasses as resists for next-generation lithography X André, JK Lee, A De Silva, N Felix, CK Ober, HB Cao, H Deng, H Kudo, ... Advances in Resist Materials and Processing Technology XXIV 6519, 1291-1300, 2007 | 48 | 2007 |
| Lithography based on molecular glasses K Tsuchiya, SW Chang, NM Felix, M Ueda, CK Ober Journal of Photopolymer Science and Technology 18 (3), 431-434, 2005 | 41 | 2005 |
| Towards all-dry lithography: Electron-beam patternable poly (glycidyl methacrylate) thin films from hot filament chemical vapor deposition Y Mao, NM Felix, PT Nguyen, CK Ober, KK Gleason Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2004 | 40 | 2004 |
| EUV patterning successes and frontiers N Felix, D Corliss, K Petrillo, N Saulnier, Y Xu, L Meli, H Tang, A De Silva, ... Extreme Ultraviolet (EUV) Lithography VII 9776, 480-486, 2016 | 39 | 2016 |
| Physical vapor deposition of molecular glass photoresists: a new route to chemically amplified patterning F Pfeiffer, NM Felix, C Neuber, CK Ober, HW Schmidt Advanced Functional Materials 17 (14), 2336-2342, 2007 | 38 | 2007 |
| Materials for future lithography SW Chang, D Yang, J Dai, N Felix, D Bratton, K Tsuchiya, YJ Kwark, ... Advances in Resist Technology and Processing XXII 5753, 1-9, 2005 | 36 | 2005 |
| Materials for future lithography SW Chang, D Yang, J Dai, N Felix, D Bratton, K Tsuchiya, YJ Kwark, ... Advances in Resist Technology and Processing XXII 5753, 1-9, 2005 | 36 | 2005 |
| Molecular glass resists for next generation lithography D Bratton, R Ayothi, N Felix, H Cao, H Deng, CK Ober Advances in Resist Technology and Processing XXIII 6153, 467-475, 2006 | 31 | 2006 |
| Overlay improvement roadmap: strategies for scanner control and product disposition for 5-nm overlay NM Felix, AH Gabor, VC Menon, PP Longo, SD Halle, C Koay, ... Metrology, Inspection, and Process Control for Microlithography XXV 7971 …, 2011 | 29 | 2011 |
| Calix [4] resorcinarene Derivatives as High‐Resolution Resist Materials for Supercritical CO2 Processing NM Felix, A De Silva, CK Ober Advanced Materials 20 (7), 1303-1309, 2008 | 28 | 2008 |
