| A review of surface engineering issues critical to wind turbine performance N Dalili, A Edrisy, R Carriveau Renewable and Sustainable energy reviews 13 (2), 428-438, 2009 | 754 | 2009 |
| Improving the wear resistance of Ti–6Al–4V/TiC composites through thermal oxidation (TO) N Dalili, A Edrisy, K Farokhzadeh, J Li, J Lo, AR Riahi Wear 269 (7-8), 590-601, 2010 | 83 | 2010 |
| A route to low temperature growth of single crystal GaN on sapphire P Motamedi, N Dalili, K Cadien Journal of Materials Chemistry C 3 (28), 7428-7436, 2015 | 46 | 2015 |
| Thermal and electrical stability of TaN x diffusion barriers for Cu metallization N Dalili, Q Liu, DG Ivey Journal of Materials Science 48, 489-501, 2013 | 17 | 2013 |
| Microstructural characterization of the cycling behavior of electrodeposited manganese oxide supercapacitors using 3D electron tomography N Dalili, MP Clark, E Davari, DG Ivey Journal of Power Sources 328, 318-328, 2016 | 16 | 2016 |
| Ta–Rh binary alloys as a potential diffusion barrier between Cu and Si: Stability and failure mechanism of the Ta–Rh amorphous structures N Dalili, Q Liu, DG Ivey Acta materialia 61 (14), 5365-5374, 2013 | 10 | 2013 |
| In situ TEM study of stability of TaRhx diffusion barriers using a novel sample preparation method N Dalili, P Li, M Kupsta, Q Liu, DG Ivey Micron 58, 25-31, 2014 | 8 | 2014 |
| A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging N Dalili, A He, Q Liu, DG Ivey Journal of electronic materials 39, 1554-1561, 2010 | 3 | 2010 |
| Amorphous Ta-N as a Diffusion Barrier for Cu Metallization N Dalili, Q Liu, DG Ivey MRS Online Proceedings Library (OPL) 1335, mrss11-1335-o06-03, 2011 | 1 | 2011 |
| Enhancement of mechanical and tribological properties of ti-6Al-4V alloy N Dalili University of Windsor, 2008 | 1 | 2008 |
| Stability of TaRhx as a potential diffusion barrier for Cu metallization: capacitance–voltage tests after bias temperature stress N Dalili, DG Ivey Journal of Materials Science: Materials in Electronics 25, 897-905, 2014 | | 2014 |
| Design of Amorphous Diffusion Barriers for Cu Metallization N Dalili | | 2014 |
| Corrigendum to" Ta-Rh binary alloys as a potential diffusion barrier between Cu and Si: Stability and failure mechanism of the Ta-Rh amorphous structures"[Acta Mater. 61 (2013 … N Dalili, Q Liu, DG Ivey Acta Materialia 62, 286-286, 2014 | | 2014 |
| Stability of Glassy Ta-Rh Diffusion Barriers for Cu Metallization N Dalili, Q Liu, DG Ivey ECS Transactions 50 (32), 63, 2013 | | 2013 |
| Thermodynamic Stability and Diffusion Barrier Properties of Amorphous Ta-Rh Alloys for Cu Metallization N Dalili, Q Liu, D Ivey AIP Conference Proceedings, 2012 | | 2012 |
| Optimization of Solutions to Electrodeposit Sn-Based Pb-Free Solders N Dalili, A He, Q Liu, D Ivey Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2010 | | 2010 |
