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Dongmin Shin
Dongmin Shin
Togi Inc.
Verified email at togi.co
Title
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Year
Ednet: A large-scale hierarchical dataset in education
Y Choi, Y Lee, D Shin, J Cho, S Park, S Lee, J Baek, C Bae, B Kim, J Heo
International Conference on Artificial Intelligence in Education, 69-73, 2020
652020
Towards an appropriate query, key, and value computation for knowledge tracing
Y Choi, Y Lee, J Cho, J Baek, B Kim, Y Cha, D Shin, C Bae, J Heo
Proceedings of the Seventh ACM Conference on Learning@ Scale, 341-344, 2020
372020
Saint+: Integrating temporal features for ednet correctness prediction
D Shin, Y Shim, H Yu, S Lee, B Kim, Y Choi
LAK21: 11th International Learning Analytics and Knowledge Conference, 490-496, 2021
312021
Assessment modeling: fundamental pre-training tasks for interactive educational systems
Y Choi, Y Lee, J Cho, J Baek, D Shin, H Yu, Y Shim, S Lee, J Shin, C Bae, ...
arXiv preprint arXiv:2002.05505, 2020
112020
Deep attentive study session dropout prediction in mobile learning environment
Y Lee, D Shin, HB Loh, J Lee, P Chae, J Cho, S Park, J Lee, J Baek, ...
arXiv preprint arXiv:2002.11624, 2020
42020
Prescribing Deep Attentive Score Prediction Attracts Improved Student Engagement
Y Lee, B Kim, D Shin, JH Kim, J Baek, J Lee, Y Choi
arXiv preprint arXiv:2005.05021, 2020
22020
Knowledge Transfer by Discriminative Pre-training for Academic Performance Prediction
B Kim, H Yu, D Shin, Y Choi
arXiv preprint arXiv:2107.04009, 2021
12021
Recommendation for Effective Standardized Exam Preparation
H Loh, D Shin, S Lee, J Baek, C Hwang, Y Lee, Y Cha, S Kwon, J Park, ...
LAK21: 11th International Learning Analytics and Knowledge Conference, 397-404, 2021
12021
User Knowledge Tracking Device, System, and Operation Method thereof Based on Artificial Intelligence Learning
D min Shin, YG Shim, HG YU, SW Lee, BS Kim, YD Choi
US Patent App. 17/503,103, 2022
2022
Artificial intelligence learning-based user knowledge tracing system and operating method thereof
YD Choi, YN Lee, JH Cho, JE Baek, BS Kim, YM Cha, D min Shin, ...
US Patent App. 17/177,196, 2021
2021
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