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Sinan Su, Ph.D.
Sinan Su, Ph.D.
CAVE3, Industrial & Systems Engineering, Auburn University
Verified email at auburn.edu
Title
Cited by
Cited by
Year
A state-of-the-art review of fatigue life prediction models for solder joint
S Su, FJ Akkara, R Thaper, A Alkhazali, M Hamasha, S Hamasha
Journal of Electronic Packaging 141 (4), 040802, 2019
632019
Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life
S Hamasha, F Akkara, S Su, H Ali, P Borgesen
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018
432018
Solder joint reliability in isothermal varying load cycling
S Su, F Akkara, A Dawahdeh, P Borgesen, A Qasaimeh
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017
422017
Effect of surface finish and high bi solder alloy on component reliability in thermal cycling
F Akkara, M Abueed, M Rababah, C Zhao, S Su, J Suhling, J Evans
2018 IEEE 68th electronic components and technology conference (ECTC), 2032-2040, 2018
352018
Fatigue properties of lead-free doped solder joints
S Su, FJ Akkara, M Abueed, M Jian, J Suhling, P Lall
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
342018
Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
S Su, N Fu, S Akkara, Francy John, Hamasha
Journal of Electronic Packaging 140 (3), 031005, 2018
322018
Effect of solder sphere alloys and surface finishes on the reliability of lead-free solder joints in accelerated thermal cycling
FJ Akkara, C Zhao, R Athamenh, S Su, M Abueed, S Hamasha, J Suhling, ...
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018
252018
Effects of surface finish on the shear fatigue of SAC-based solder alloys
S Su, M Jian
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019
212019
Effect of aging on the fatigue life and shear strength of SAC305 solder joints in actual setting conditions
R Al Athamneh, M Abueed, DB Hani, S Su, J Suhling, P Lall
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
212019
Effect of surface finish on the shear properties of SnAgCu-based solder alloys
S Su, K Hamasha
IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019
192019
EFFECTS OF LONG-TERM AGING ON SnAgCu SOLDER JOINTS RELIABILITY IN MECHANICAL CYCLING FATIGUE
FJ Akkara, S Su, S Thirugnanasambandam, A Dawahdeh, ...
SMTA International, 419-425, 2017
192017
Fatigue properties and microstructure of SnAgCu Bi-based solder joint
M Jian, S Su, S Hamasha, MM Hamasha, A Alkhazali
Journal of Electronic Packaging 143 (1), 011008, 2021
152021
Mechanical properties and microstructural fatigue damage evolution in cyclically loaded lead-free solder joints
S Su, MA Hoque, MM Chowdhury, JC Suhling, JL Evans, P Lall
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 792-799, 2019
152019
Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications
S Sinan, J Minghong, JA Francy, H Sa’d, S Jeff, L Pradeep
SMTA International 2018, 2018
152018
Effect of surface finish on the fatigue behavior of Bi-based solder joints
S Su, M Jian, X Wei, FJ Akkara, J Suhling, P Lall
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
142019
Effects of Mixing Solder Sphere Alloys with Bismuth-Based Pastes on The Component Reliability in Harsh Thermal Cycling
JA Francy, S Sinan, Z Cong, H Sa’d, S Jeffrey, L Pradeep
SMTA International 2018, 2018
132018
Reliability of micro-alloyed SnAgCu Based solder interconnections for various harsh applications
S Su, FJ Akkara, A Raj, C Zhao, S Gordon, S Sridhar, ...
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2309-2317, 2019
112019
Fatigue performance of doped SAC solder joints in BGA assembly
X Wei, S Su, H Ali, J Suhling, P Lall
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020
82020
Effect of Aging on Component Reliability in Harsh Thermal Cycling
FJ Akkara, C Zhao, S Gordon, S Su, M Abueed, J Suhling, P Lall
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
82019
Reliability of doped SnAgCu solder alloys with various surface finishes under realistic service conditions
S Su
Auburn University, 2019
62019
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