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- Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial ProfessorVerified email at stanford.edu
- H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Feng XiongAssociate Professor, Department of Electrical and Computer Engineering, University of PittsburghVerified email at pitt.edu
- David EstradaBoise State University; Idaho National LaboratoryVerified email at boisestate.edu
- Myung-Ho BaeKorea Research Institute of Standards and Science, mhbae@kriss.re.krVerified email at kriss.re.kr
- Eilam YalonTechnion, Israel Institute of TechnologyVerified email at technion.ac.il
- Connor J. McClellanStanford UniversityVerified email at stanford.edu
- Ashkan BehnamDevice Engineer, MicronVerified email at micron.com
- Krishna SaraswatProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Joseph W. LydingProfessor of Electrical and Computer Engineering, University of IllinoisVerified email at illinois.edu
- Albert LiaoEmerging Memory Engineer, MicronVerified email at micron.com
- Sanchit DeshmukhPhD, Stanford UniversityVerified email at alumni.stanford.edu
- Zhun-Yong OngResearch Scientist, Institute of High Performance Computing, SingaporeVerified email at ihpc.a-star.edu.sg
- Dr. Miguel Muņoz Rojo - ERC granteeTenured permanent researcher (CSIC) & Associate Prof. (University of Twente)Verified email at csic.es
- Hongjie DaiProfessor of chemistry, stanford universityVerified email at stanford.edu
- Joshua D. WoodPrincipal Solutions Engineer, DynatraceVerified email at dynatrace.com
- Saurabh V. SuryavanshiSynopsysVerified email at suryavanshi.me
- Asir Intisar KhanPostdoc, Materials Science, Lawrence Berkeley Lab | PhD, EE, Stanford UniversityVerified email at berkeley.edu
- Alwin DausInstitute of Semiconductor Engineering, University of StuttgartVerified email at iht.uni-stuttgart.de
- Feifei LianStanford UniversityVerified email at stanford.edu